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參數(shù)資料
| 型號： | AD5432YRM |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC MULTIPLYING 10BIT 10-MSOP |
| 產(chǎn)品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 設計資源： | Unipolar, Precision DC Digital-to-Analog Conversion Using AD5426/32/43 8-Bit to12-Bit DACs (CN0034) Precision, Bipolar Configuration for the AD5426/32/43 8-Bit to12-Bit DACs (CN0036) AC Signal Processing Using AD5426/32/43 Current Output DACs (CN0037) Programmable Gain Element Using AD5426/32/43 Current Output DACs (CN0038) |
| 標準包裝： | 50 |
| 位數(shù)： | 10 |
| 數(shù)據(jù)接口： | 串行 |
| 轉換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應商設備封裝： | 10-MSOP |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極；2 電流，雙極 |
| 采樣率（每秒）： | 2.5M |
AD5426/AD5432/AD5443
Data Sheet
Rev. G | Page 22 of 24
PCB LAYOUT AND POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. The printed circuit board on which the
that the analog and digital sections are separated and confined
to certain areas of the board. If the DAC is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only. The star ground
point should be established as close to the device as possible.
The DAC should have ample supply bypassing of 10 F in parallel
with 0.1 F on the supply located as close to the package as
possible, ideally right up against the device. The 0.1 F capacitor
should have low effective series resistance (ESR) and effective
series inductance (ESI), like the common ceramic types that
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching. Low
ESR, 1 F to 10 F tantalum or electrolytic capacitors should
also be applied at the supplies to minimize transient disturbance
and filter out low frequency ripple.
Fast switching signals such as clocks should be shielded with
digital ground to avoid radiating noise to other parts of the
board and should never be run near the reference inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A micro-
strip technique is by far the best, but not always possible with a
double-sided board. In this technique, the component side of the
board is dedicated to ground plane while signal traces are placed
on the solder side.
It is good practice to employ compact, minimum lead length
PCB layout design. Leads to the input should be as short as
possible to minimize IR drops and stray inductance.
The PCB metal traces between VREF and RFB should also be
matched to minimize gain error. To maximize on high frequency
performance, the I-to-V amplifier should be located as close to
the device as possible.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AD5432YRM-REEL | 制造商:Analog Devices 功能描述:DAC 1-CH R-2R 10-bit 10-Pin MSOP T/R 制造商:Analog Devices 功能描述:DAC 1CH R-2R 10-BIT 10MSOP - Tape and Reel 制造商:Rochester Electronics LLC 功能描述:10-IOUT DAC WITH SERIAL ITF I.C. - Tape and Reel |
| AD5432YRM-REEL7 | 功能描述:IC DAC 10BIT MULTIPLYING 10-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉換器 系列:- 標準包裝:2,400 系列:- 設置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應商設備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| AD5432YRMZ | 功能描述:IC DAC 10BIT MULTIPLYING 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉換器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 設置時間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF) |
| AD5432YRMZ-REEL | 功能描述:IC DAC 10BIT MULTIPLYING 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉換器 系列:- 產(chǎn)品培訓模塊:Data Converter Fundamentals DAC Architectures 設計資源:Unipolar, Precision DC Digital-to-Analog Conversion using AD5450/1/2/3 8-14-Bit DACs (CN0052) Precision, Bipolar, Configuration for AD5450/1/2/3 8-14bit Multiplying DACs (CN0053) AC Signal Processing Using AD5450/1/2/3 Current Output DACs (CN0054) Programmable Gain Element Using AD5450/1/2/3 Current Output DAC Family (CN0055) Single Supply Low Noise LED Current Source Driver Using a Current Output DAC in the Reverse Mode (CN0139) 標準包裝:10,000 系列:- 設置時間:- 位數(shù):12 數(shù)據(jù)接口:DSP，MICROWIRE?，QSPI?，串行，SPI? 轉換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-8 薄型，TSOT-23-8 供應商設備封裝:TSOT-23-8 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:2.7M |
| AD5432YRMZ-REEL7 | 功能描述:IC DAC 10BIT MULTIPLYING 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉換器 系列:- 產(chǎn)品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產(chǎn)品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數(shù):10 數(shù)據(jù)接口:MICROWIRE?，串行，SPI? 轉換器數(shù)目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
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