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參數(shù)資料
型號: AD5752AREZ
廠商: Analog Devices Inc
文件頁數(shù): 28/32頁
文件大?。?/td> 0K
描述: IC DAC DUAL 16BIT SERIAL 24TSSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
設(shè)計資源: Software Configurable 16-Bit Dual-Channel Unipolar/Bipolar Voltage Output Using AD5752 (CN0092)
標(biāo)準(zhǔn)包裝: 62
設(shè)置時間: 10µs
位數(shù): 16
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 模擬和數(shù)字,雙 ±
功率耗散(最大): 190mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-TSSOP(0.173",4.40mm)裸露焊盤
供應(yīng)商設(shè)備封裝: 24-TSSOP 裸露焊盤
包裝: 管件
輸出數(shù)目和類型: 2 電壓,單極;2 電壓,雙極
采樣率(每秒): *
產(chǎn)品目錄頁面: 784 (CN2011-ZH PDF)
AD5722/AD5732/AD5752
Rev. D | Page 5 of 32
AC PERFORMANCE CHARACTERISTICS
AVDD = 4.5 V1 to 16.5 V; AVSS = 4.5 V to 16.5 V, or AVSS = 0 V; GND = 0 V; REFIN = 2.5 V; DVCC = 2.7 V to 5.5 V; RLOAD = 2 kΩ;
CLOAD = 200 pF; all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter2
Min
Typ
Max
Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time
10
12
μs
20 V step to ±0.03% FSR
7.5
8.5
μs
10 V step to ±0.03% FSR
5
μs
512 LSB step settling (16-bit resolution)
Slew Rate
3.5
V/μs
Digital-to-Analog Glitch Energy
13
nV-sec
Glitch Impulse Peak Amplitude
35
mV
Digital Crosstalk
10
nV-sec
DAC-to-DAC Crosstalk
10
nV-sec
Digital Feedthrough
0.6
nV-sec
Output Noise
0.1 Hz to 10 Hz Bandwidth
15
μV p-p
0x8000 DAC code
100 kHz Bandwidth
80
μV rms
Output Noise Spectral Density
320
nV/√Hz
Measured at 10 kHz, 0x8000 DAC code
1 For specified performance, the maximum headroom requirement is 0.9 V.
2 Guaranteed by design and characterization; not production tested.
TIMING CHARACTERISTICS
AVDD = 4.5 V to 16.5 V; AVSS = 4.5 V to 16.5 V, or AVSS = 0 V; GND = 0 V; REFIN = 2.5 V; DVCC = 2.7 V to 5.5 V; RLOAD = 2 kΩ; CLOAD =
200 pF; all specifications tMIN to tMAX, unless otherwise noted.
Table 3.
Parameter1, 2, 3
Limit at tMIN, tMAX
Unit
Description
t1
33
ns min
SCLK cycle time
t2
13
ns min
SCLK high time
t3
13
ns min
SCLK low time
t4
13
ns min
SYNC falling edge to SCLK falling edge setup time
t5
13
ns min
SCLK falling edge to SYNC rising edge
t6
100
ns min
Minimum SYNC high time (write mode)
t7
7
ns min
Data setup time
t8
2
ns min
Data hold time
t9
20
ns min
LDAC falling edge to SYNC falling edge
t10
130
ns min
SYNC rising edge to LDAC falling edge
t11
20
ns min
LDAC pulse width low
t12
10
μs max
DAC output settling time
t13
20
ns min
CLR pulse width low
t14
2.5
μs max
CLR pulse activation time
ns min
SYNC rising edge to SCLK falling edge
40
ns max
SCLK rising edge to SDO valid (CL SDO5 = 15 pF)
t17
200
ns min
Minimum SYNC high time (readback/daisy-chain mode)
1 Guaranteed by characterization; not production tested.
2 All input signals are specified with tR = tF = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3 See Figure 2, Figure 3, and Figure 4.
4 Daisy-chain and readback mode.
5 CL SDO = capacitive load on SDO output.
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