AD7304/AD7305
Rev. C | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
0.3 V, +8 V
VSS to GND
+0.3 V,
8 V
VREFX to GND
VSS, VDD
Logic Inputs to GND
0.3 V, VDD + 0.3 V
VOUTX to GND
0.3 V, VDD + 0.3 V
IOUT Short-Circuit to GND
50 mA
Package Power Dissipation
(TJ MAX – TA)/
θJA
Thermal Resistance
θJA
16-Lead SOIC Package (R-16)
73°C/W
16-Lead TSSOP Package (RU-16)
180°C/W
20-Lead SOIC Package (R-20)
74°C/W
20-Lead TSSOP Package (RU-20)
155°C/W
Maximum Junction Temperature (TJ MAX)
150°C
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Lead Temperature
R-16, R-20, RU-16, RU-20 (Vapor Phase, 60 sec)
235°C
R-16, R-20, RU-16, RU-20 (Infrared, 15 sec)
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.