(TA = +25 °C unless otherwise noted" />
參數(shù)資料
型號: AD73311LARSZ
廠商: Analog Devices Inc
文件頁數(shù): 36/36頁
文件大小: 0K
描述: IC PROCESSOR FRONT END LP 20SSOP
標(biāo)準(zhǔn)包裝: 66
位數(shù): 16
通道數(shù): 2
功率(瓦特): 50mW
電壓 - 電源,模擬: 3V
電壓 - 電源,數(shù)字: 3V
封裝/外殼: 20-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 20-SSOP
包裝: 管件
AD73311
–9–
REV. B
ABSOLUTE MAXIMUM RATINGS*
(TA = +25
°C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Digital I/O Voltage to DGND . . . . . .–0.3 V to DVDD + 0.3 V
Analog I/O Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . +150
°C
SOIC,
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SSOP,
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 90°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature
Package
Model
Range
Option
1
AD73311AR
–40
°C to +85°C
R-20
AD73311ARS
–40
°C to +85°C
RS-20
EVAL-AD73311EB
Evaluation Board
2
+EZ-KIT Lite Upgrade
3
EVAL-AD73311EZ
Evaluation Board
2
+EZ-KIT Lite
4
NOTES
1R = 0.3' Small Outline IC (SOIC), RS = Shrink Small Outline Package (SSOP).
2The AD73311 evaluation board features a selectable number of codecs in
cascade (from 1 to 4). It can be interfaced to an ADSP-2181 EZ-KIT Lite or
to a Texas Instruments EVM kit.
3The upgrade consists of a replacement PROM and connector. This option is
intended for existing owners of EZ-KIT Lite.
4The EZ-KIT Lite has been modified to allow it to interface with the AD73311
evaluation board. This option is intended for users who do not already have an
EZ-KIT Lite.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD73311 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
VOUTP
SDOFS
SDIFS
SDI
SE
VOUTN
AVDD1
AGND1
AD73311
SCLK
MCLK
SDO
VINP
VINN
REFOUT
REFCAP
AVDD2
AGND2
DGND
DVDD
RESET
WARNING!
ESD SENSITIVE DEVICE
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