AD7715
Rev. D | Page 9 of 40
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
AVDD to AGND
0.3 V to +7 V
AVDD to DGND
0.3 V to +7 V
AVDD to DVDD
0.3 V to +7 V
DVDD to AGND
0.3 V to +7 V
DVDD to DGND
0.3 V to +7 V
DGND to AGND
0.3 V to +7 V
Analog Input Voltage to AGND
0.3 V to AVDD + 0.3 V
Reference Input Voltage to AGND
0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND
0.3 V to DVDD + 0.3 V
Operating Temperature Range
Commercial (A Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Plastic DIP Package, Power Dissipation
450 mW
θJA Thermal Impedance
105°C/W
Lead Temperature, (Soldering, 10 sec)
260°C
SOIC Package, Power Dissipation
450 mW
θJA Thermal Impedance
75°C/W
Lead Temperature, Reflow Soldering
260°C
TSSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
128°C/W
Lead Temperature, Reflow Soldering
+260°C
Power Dissipation (Any Package) to +75°C
450 mW
ESD Rating
>4000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION