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參數(shù)資料
| 型號： | AD7827BRZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 7/12頁 |
| 文件大小： | 0K |
| 描述： | IC ADC 8BIT SAMPLING SRL 8SOIC |
| 產(chǎn)品變化通告： | AD7827 Series Discontinuation 18/Jul/2012 |
| 標準包裝： | 1,000 |
| 位數(shù)： | 8 |
| 采樣率（每秒）： | 1M |
| 數(shù)據(jù)接口： | DSP，串行 |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 30mW |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
| 輸入數(shù)目和類型： | 1 個單端，單極 |
AD7827
–4–
REV. 0
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7827 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN FUNCTION DESCRIPTIONS
Pin No.
Mnemonic
Description
1
CONVST
Convert Start. Puts the track-and-
hold into hold mode and initiates a
conversion.
The state of this pin at the end of
conversion also determines whether
or not the part is powered down.
2V
IN
Analog Input is applied here.
3
RFS
Receive Frame Sync. This is an
output. When this signal goes logic
high at the end of a conversion, the
DSP starts latching in data on the
next cycle of SCLK.
4
GND
Ground reference for analog and
digital circuitry.
5V
REF
Reference Input.
6D
OUT
Serial Data is shifted out on this pin.
Data is clocked out by the rising
edges of SCLK.
7
SCLK
Serial Clock. An external serial clock
is applied here. The clock must be
continuous so the RFS (frame SYNC)
can be synchronized to the clock for
high speed data transfers. (See
Microprocessor Interfacing section.)
8V
DD
Positive Supply Voltage 3 V/5 V
± 10%.
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
CONVST
VIN
RFS
VDD
SCLK
DOUT
VREF
GND
AD7827
ABSOLUTE MAXIMUM RATINGS*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND
(
CONVST, SCLK) . . . . . . . . . . . . . . –0.3 V, V
DD + 0.3 V
Digital Output Voltage to GND
(DOUT, RFS) . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Analog Input Voltage to AGND . . . . . . –0.3 V, VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300
°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . +105°C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . +75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Linearity
Error
Package
Model
(LSB)
Description
Option
AD7827BN
±0.5 LSB
Plastic DIP
N-8
AD7827BR
±0.5 LSB
Small Outline IC
SO-8
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