參數(shù)資料
型號: AD8016AREZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 14/21頁
文件大?。?/td> 0K
描述: IC LINE DRIVER ADSL 28TSSOP
標準包裝: 2,500
類型: 驅動器
驅動器/接收器數(shù): 2/0
規(guī)程: xDSL
電源電壓: 3 V ~ 13 V
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.173",4.40mm 寬)裸露焊盤
供應商設備封裝: 28-HTSSOP
包裝: 帶卷 (TR)
AD8016
Data Sheet
Rev. C | Page 20 of 20
OUTLINE DIMENSIONS
Figure 50. 24-Lead Batwing SOIC, Thermally Enhanced w/Fused Leads [SOIC_W_BAT]
(RB-24)
Dimensions shown in millimeters
Figure 51. 28-Lead Thin Shrink Small Outline With Exposed Pad [TSSOP_EP]
(RE-28-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
AD8016ARBZ
40°C to +85°C
24-Lead SOIC_W_BAT
RB-24
AD8016ARBZ-REEL
40°C to +85°C
24-Lead SOIC_W_BAT
RB-24
AD8016AREZ
40°C to +85°C
28-Lead TSSOP_EP
RE-28-1
AD8016AREZ-REEL
40°C to +85°C
28-Lead TSSOP_EP
RE-28-1
AD8016AREZ-REEL7
40°C to +85°C
28-Lead TSSOP_EP
RE-28-1
1 Z = RoHS Compliant Part.
0.32
0.23
1.27
0.40
0.75
0.25
45°
24
13
12
1
15.60
15.20
7.60
7.40
PIN 1
10.65
10.00
SEATING
PLANE
0.30
0.10
0.51
0.33
2.65
2.35
1.27
BSC
COMPLIANT WITH JEDEC STANDARDS MS-013-AD
COMPLIANT TO JEDEC STANDARDS MO-153-AET
28
15
14
1
EXPOSED
PAD
(Pins Up)
9.80
9.70
9.60
4.50
4.40
4.30
6.40
BSC
TOP VIEW
BOTTOM VIEW
0.65 BSC
0.15
0.05
COPLANARITY
0.10
1.20 MAX
1.05
1.00
0.80
0.30
0.19
SEATING
PLANE
0.20
0.09
3.05
3.00
2.95
0.75
0.60
0.45
3.55
3.50
3.45
02
-23-
201
2-
A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D01019-0-3/12(C)
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