參數(shù)資料
型號(hào): AD8332ARU-REEL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 49/56頁(yè)
文件大?。?/td> 0K
描述: IC VGA DUAL W/PREAMP LN 28-TSSOP
標(biāo)準(zhǔn)包裝: 1,000
系列: X-AMP®
類型: 可變?cè)鲆娣糯笃?br>
應(yīng)用: 信號(hào)處理
安裝類型: 表面貼裝
封裝/外殼: 28-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 28-TSSOP
包裝: 帶卷 (TR)
配用: AD8332-EVALZ-ND - BOARD EVAL FOR AD8332
AD8331/AD8332/AD8334
Rev. G | Page 53 of 56
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
14
1
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AD
08
19
08
-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
20
11
10
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81) 0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
Figure 123. 20-Lead Shrink Small Outline Package (QSOP)
(RQ-20)
Dimensions shown in Inches and (millimeters
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AD8332-EVAL 制造商:Analog Devices 功能描述:DUAL VGA - Bulk