參數(shù)資料
型號(hào): AD8332ARU-REEL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 51/56頁(yè)
文件大小: 0K
描述: IC VGA DUAL W/PREAMP LN 28-TSSOP
標(biāo)準(zhǔn)包裝: 1,000
系列: X-AMP®
類型: 可變?cè)鲆娣糯笃?br>
應(yīng)用: 信號(hào)處理
安裝類型: 表面貼裝
封裝/外殼: 28-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 28-TSSOP
包裝: 帶卷 (TR)
配用: AD8332-EVALZ-ND - BOARD EVAL FOR AD8332
AD8331/AD8332/AD8334
Rev. G | Page 55 of 56
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD8331ARQ
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQ-REEL
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQ-REEL7
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ-RL
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ-R7
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331-EVALZ
Evaluation Board with AD8331ARQ
AD8332ACP-R2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACP-REEL
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACP-REEL7
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-R2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-R7
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-RL
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ARU
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARU-REEL
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARU-REEL7
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ-R7
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ-RL
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332-EVALZ
Evaluation Board with AD8332ARU
AD8334ACPZ
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334ACPZ-REEL
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334ACPZ-REEL7
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334-EVALZ
Evaluation Board with AD8334ACP
1 Z = RoHS Compliant Part.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD8332ARUZ 功能描述:IC VGA DUAL W/PREAMP LN 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤(pán)
AD8332ARUZ 制造商:Analog Devices 功能描述:IC PRE-AMP ULTRA LOW NOISE
AD8332ARUZ-R7 功能描述:IC AMP VAR GAIN 2CHAN 28TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤(pán)
AD8332ARUZ-RL 功能描述:IC AMP VAR GAIN 2CHAN 28TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤(pán)
AD8332-EVAL 制造商:Analog Devices 功能描述:DUAL VGA - Bulk