參數(shù)資料
型號(hào): AD8334ACPZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 49/56頁
文件大小: 0K
描述: IC VGA QUAD W/PREAMP 64-LFCSP
標(biāo)準(zhǔn)包裝: 2,500
系列: X-AMP®
類型: 可變?cè)鲆娣糯笃?br>
應(yīng)用: 信號(hào)處理
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 64-LFCSP-VQ(9x9)
包裝: 帶卷 (TR)
配用: AD8334-EVALZ-ND - BOARD EVALUATION FOR AD8334
AD8331/AD8332/AD8334
Rev. G | Page 53 of 56
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
14
1
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AD
08
19
08
-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
20
11
10
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81) 0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
Figure 123. 20-Lead Shrink Small Outline Package (QSOP)
(RQ-20)
Dimensions shown in Inches and (millimeters
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