參數(shù)資料
型號(hào): AD9608-125EBZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 2/40頁(yè)
文件大?。?/td> 0K
描述: BOARD EVAL AD9608-125
標(biāo)準(zhǔn)包裝: 1
ADC 的數(shù)量: 2
位數(shù): 10
采樣率(每秒): 125M
數(shù)據(jù)接口: 串行
工作溫度: -40°C ~ 85°C
已用 IC / 零件: AD9608
已供物品:
AD9608
Rev. 0 | Page 10 of 40
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0 V
VIN+A/VIN+B, VINA/VINB to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to AVDD + 0.2 V
SYNC to AGND
0.3 V to AVDD + 0.2 V
VCM to AGND
0.3 V to AVDD + 0.2 V
RBIAS to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.2 V
SCLK/DFS to AGND
0.3 V to DRVDD + 0.2 V
SDIO/DCS to AGND
0.3 V to DRVDD + 0.2 V
OEB
0.3 V to DRVDD + 0.2 V
PDWN
0.3 V to DRVDD + 0.2 V
D0A, D0B through D9A, D9B to AGND
0.3 V to DRVDD + 0.2 V
DCOA
, DCOB to AGND
0.3 V to DRVDD + 0.2 V
Environmental
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
Airflow
Velocity
(m/sec)
Ψ
Unit
0
22.3
1.4
N/A
0.1
°C/W
1.0
19.5
N/A
11.8
0.2
°C/W
64-Lead
LFCSP
9 mm × 9 mm
(CP-64-4)
2.5
17.5
N/A
0.2
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θJA.
ESD CAUTION
1 The inputs and outputs are rated to the supply voltage (AVDD or DRVDD)
+
0.2 V but should not exceed 2.1 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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