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參數(shù)資料
| 型號： | ADG888YRUZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH DUAL DPDT 16TSSOP |
| 產品培訓模塊： | Switch Fundamentals |
| 標準包裝： | 1,000 |
| 功能： | 開關 |
| 電路： | 2 x DPDT - NC/NO |
| 導通狀態(tài)電阻： | 480 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 電流 - 電源： | 3nA |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應商設備封裝： | 16-TSSOP |
| 包裝： | 帶卷 (TR) |
ADG888
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
0.3 V to +6 V
Analog Inputs, Digital Inputs1
0.3 V to VDD + 0.3 V or 30 mA,
whichever occurs first
Peak Current, S or D
5 V operation
600 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, S or D
5 V operation
400 mA
Operating Temperature Range
Automotive (Y Version)
TSSOP and LFCSP packages
40°C to +125°C
Industrial (B version)
WLCSP package
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
16-Lead TSSOP Package
θJA Thermal Impedance
(4-Layer Board)
112°C/W
θJC Thermal Impedance
27.6°C/W
16-Lead WLCSP Package
θJA Thermal Impedance
(4-Layer Board)
130°C/W
16-Lead LFCSP Package
θJA Thermal Impedance
(4-Layer Board)
30.4°C/W
Reflow Soldering (Pb-Free)
Peak Temperature
260(+0/5)°C
Time at Peak Temperature
10 sec to 40 sec
1 Overvoltages at IN, S, or D are clamped by internal diodes. Limit current to
the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one
time.
ESD CAUTION
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