參數(shù)資料
型號: ADN2804ACPZ-500RL7
廠商: Analog Devices Inc
文件頁數(shù): 14/24頁
文件大?。?/td> 0K
描述: IC CLK/DATA REC 622MBPS 32-LFCSP
標(biāo)準包裝: 500
類型: 時鐘和數(shù)據(jù)恢復(fù)(CDR),多路復(fù)用器
PLL:
主要目的: SONET/SDH
輸入: CML
輸出: LVDS
電路數(shù): 1
比率 - 輸入:輸出: 1:2
差分 - 輸入:輸出: 是/是
頻率 - 最大: 622MHz
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-VQ(5x5)
包裝: 帶卷 (TR)
Data Sheet
ADN2804
Rev. C | Page 21 of 24
APPLICATIONS INFORMATION
PCB DESIGN GUIDELINES
Proper RF PCB design techniques must be used for optimal
performance.
Power Supply Connections and Ground Planes
Use of one low impedance ground plane is recommended. The
VEE pins should be soldered directly to the ground plane to
reduce series inductance. If the ground plane is an internal
plane and connections to the ground plane are made through
vias, multiple vias can be used in parallel to reduce the series
inductance, especially on Pin 23, which is the ground return for
the output buffers. The exposed pad should be connected to the
GND plane using plugged vias so that solder does not leak
through the vias during reflow.
Use of a 22 μF electrolytic capacitor between VCC and VEE is
recommended at the location where the 3.3 V supply enters the
PCB. When using 0.1 μF and 1 nF ceramic chip capacitors, they
should be placed between ADN2804 supply pins VCC and VEE,
as close as possible to the ADN2804 VCC pins.
If connections to the supply and ground are made through
vias, the use of multiple vias in parallel helps to reduce series
inductance, especially on Pin 24, which supplies power to the
high speed CLKOUTP/CLKOUTN and DATAOUTP/
DATAOUTN output buffers. Refer to Figure 24 for the
recommended connections.
By placing the power supply and GND planes adjacent to each
other and using close spacing between the planes, excellent high
frequency decoupling can be realized. The capacitance is given
by
( )
pF
/
0.88ε
r
d
A
C
PLANE =
where:
ε
r
is the dielectric constant of the PCB material.
A is the area of the overlap of power and GND planes (cm2).
d is the separation between planes (mm).
For FR-4, εr = 4.4 and d = 0.25 mm; therefore,
CPLANE ~ 15.5A (pF)
C
I2C CONTROLLER
LOS
SDA
SCK
SADDR5
50 TRANSMISSION LINES
DATAOUTP
DATAOUTN
CLKOUTP
CLKOUTN
0.1F
22F
1nF
0.1F
1.6F
0.1F
0.47F ±20%
>300M INSULATION RESISTANCE
1nF
0.1F
1nF
+
VCC
50
TIA
RTH
VCC
NC
C
VCC
1
TEST1
2
VCC
3
VREF
4
NIN
5
PIN
6
SLICEP
7
SLICEN
8
VEE
24
VCC
23
VEE
22
21
20
19
18
VCC
17
VEE
9
T
H
R
A
D
J
10
R
E
F
C
L
K
P
11
R
E
F
C
L
K
N
12
V
C
13
V
E
14
C
F
2
15
C
F
1
16
L
O
L
32
T
E
S
T
2
31
V
C
30
V
E
29
D
A
TA
O
U
T
P
28
D
A
TA
O
U
T
N
27
S
Q
U
E
L
C
H
26
C
L
K
O
U
T
P
25
C
L
K
O
U
T
N
EXPOSED PAD
TIED OFF TO
VEE PLANE
WITH VIAS
058
01
-031
Figure 24. Typical ADN2804 Applications Circuit
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