參數(shù)資料
型號(hào): ADN2806ACPZ-RL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 9/20頁(yè)
文件大?。?/td> 0K
描述: IC CLK/DATA REC 622MBPS 32-LFCSP
標(biāo)準(zhǔn)包裝: 1,500
類型: 時(shí)鐘和數(shù)據(jù)恢復(fù)(CDR),多路復(fù)用器
PLL:
主要目的: SONET/SDH
輸入: CML
輸出: LVDS
電路數(shù): 1
比率 - 輸入:輸出: 1:2
差分 - 輸入:輸出: 是/是
頻率 - 最大: 622MHz
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-VQ(5x5)
包裝: 帶卷 (TR)
ADN2806
Rev. C | Page 17 of 20
APPLICATIONS INFORMATION
PCB DESIGN GUIDELINES
Proper RF PCB design techniques must be used for optimal
performance.
Power Supply Connections and Ground Planes
Use of one low impedance ground plane is recommended. The
VEE pins should be soldered directly to the ground plane to
reduce series inductance. If the ground plane is an internal
plane and connections to the ground plane are made through
vias, multiple vias can be used in parallel to reduce the series
inductance, especially on Pin 23, which is the ground return for
the output buffers. The exposed pad should be connected to the
GND plane using plugged vias so that solder does not leak
through the vias during reflow.
Use of a 22 μF electrolytic capacitor between VCC and VEE is
recommended at the location where the 3.3 V supply enters the
PCB. When using 0.1 μF and 1 nF ceramic chip capacitors, they
should be placed between ADN2806 supply pins VCC and VEE,
as close as possible to the ADN2806 VCC pins.
If connections to the supply and ground are made through
vias, the use of multiple vias in parallel helps to reduce series
inductance, especially on Pin 24, which supplies power to the
high speed CLKOUTP/CLKOUTN and DATAOUTP/
DATAOUTN output buffers. Refer to Figure 19 for the
recommended connections.
By placing the power supply and GND planes adjacent to each
other and using close spacing between the planes, excellent high
frequency decoupling can be realized. The capacitance is given by
pF
/
0.88ε
r
d
A
C
PLANE
where:
r
is the dielectric constant of the PCB material.
A
is the area of the overlap of power and GND planes (cm2).
d
is the separation between planes (mm).
For FR-4, r = 4.4 and d = 0.25 mm; therefore,
CPLANE
~ 15 pF/cm2.
50 TRANSMISSION LINES
DATAOUTP
DATAOUTN
CLKOUTP
CLKOUTN
0.1F
22F
1nF
0.1F
1.6F
0.1F
0.47F ±20%
>300M INSULATION RESISTANCE
1nF
0.1F
1nF
+
VCC
50
LIM
VCC
NC
C
I2C CONTROLLER
VCC
1
TEST1
2
VCC
3
VREF
4
NIN
5
PIN
6
NC
7
NC
8
VEE
24
VCC
23
VEE
22
NC
21
SDA
20
SCK
19
SADDR5
18
VCC
17
VEE
9
N
C
10
R
E
F
C
L
K
P
11
R
E
F
C
L
K
N
12
V
C
13
V
E
14
C
F
2
15
C
F
1
16
L
O
L
32
T
E
S
T
2
31
V
C
30
V
E
29
D
A
T
A
O
U
T
P
28
D
A
T
A
O
U
T
N
27
S
Q
U
E
L
C
H
26
C
L
K
O
U
T
P
25
C
L
K
O
U
T
N
EXPOSED PAD
TIED OFF TO
VEE PLANE
WITH VIAS
0
5831-
03
1
Figure 19. Typical ADN2806 Applications Circuit
相關(guān)PDF資料
PDF描述
MS3120F20-39SW CONN RCPT 39POS WALL MNT W/SCKT
VE-JTV-MX-F4 CONVERTER MOD DC/DC 5.8V 75W
XRT8001IDTR-F IC WAN CLOCK E1/E1 DUAL 18SOIC
VE-JTV-MX-F3 CONVERTER MOD DC/DC 5.8V 75W
VE-JTV-MX-F1 CONVERTER MOD DC/DC 5.8V 75W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADN2807 制造商:AD 制造商全稱:Analog Devices 功能描述:155/622 Mb/s Clock and Data Recovery IC with Integrated Limiting Amp
ADN2807ACP 制造商:Analog Devices 功能描述:CDR 155.52Mbps/166.63Mbps/622.08Mbps/666.51Mbps SONET/SDH 48-Pin LFCSP EP Tray
ADN2807ACP-RL 制造商:AD 制造商全稱:Analog Devices 功能描述:155/622 Mb/s Clock and Data Recovery IC with Integrated Limiting Amp
ADN2807ACPZ 功能描述:IC CLOCK/DATA RECOVERY 48LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:- 標(biāo)準(zhǔn)包裝:28 系列:- 類型:時(shí)鐘/頻率發(fā)生器 PLL:是 主要目的:Intel CPU 服務(wù)器 輸入:時(shí)鐘 輸出:LVCMOS 電路數(shù):1 比率 - 輸入:輸出:3:22 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:400MHz 電源電壓:3.135 V ~ 3.465 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:64-TFSOP (0.240",6.10mm 寬) 供應(yīng)商設(shè)備封裝:64-TSSOP 包裝:管件
ADN2807ACPZ-RL 功能描述:IC CLOCK/DATA RECOVERY 48LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:- 標(biāo)準(zhǔn)包裝:28 系列:- 類型:時(shí)鐘/頻率發(fā)生器 PLL:是 主要目的:Intel CPU 服務(wù)器 輸入:時(shí)鐘 輸出:LVCMOS 電路數(shù):1 比率 - 輸入:輸出:3:22 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:400MHz 電源電壓:3.135 V ~ 3.465 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:64-TFSOP (0.240",6.10mm 寬) 供應(yīng)商設(shè)備封裝:64-TSSOP 包裝:管件