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參數(shù)資料
| 型號(hào)： | ADN2849SURF |
| 廠商： | ANALOG DEVICES INC |
| 元件分類(lèi)： | 其它接口 |
| 英文描述： | 10.7 Gbps Electro-Absorption Modulator Driver |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, UUC27 |
| 封裝： | 2.05 X 2.05 MM, DIE-27 |
| 文件頁(yè)數(shù)： | 14/17頁(yè) |
| 文件大?。?/td> | 1425K |
| 代理商： | ADN2849SURF |
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ADN2849
Rev. Pr. G | Page 14 of 17
The following procedure can be used to estimate the IC
junction temperature.
T
TOP
= Temperature at top of package in
0
C.
T
PAD
= Temperature at package exposed paddle in
0
C.
T
J
= IC junction temperature in
0
C.
P = Power disipation in W.
θ
J-TOP
= Thermal resistance from IC junction to package top.
θ
J-PAD
= Thermal resistance from IC junction to package
exposed pad.
θ
J-PAD
P
θ
J-TOP
T
PAD
T
PAD
T
TOP
T
TOP
T
J
Fig. 32. Electrical model for thermal calculations
T
TOP
and T
PAD
can be determined by measuring the temperature
at points inside the module, as shown in fig. 30. The thermo-
couples should be positioned so as to obtain an accurate
measurement of the package top and paddle temperatures.
Using this model the junction temperature can be calculated
using the formula:
TOP
J
PAD
J
TOP
J
PAD
T
PAD
J
TOP
T
TOP
J
PAD
J
J
P
T
+
×
+
×
+
×
×
=
θ
θ
θ
θ
θ
θ
(
)
Where
θ
J-TOP
and θ
J-PAD
are given in table 3 and P is the power
dissipated by the ADN2849 obtained from the graph shown in
figure 28
.
Preliminary Technical Data
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