- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄5795 > ADN2892ACPZ-RL7 (Analog Devices Inc)IC AMP LIM 16LFCSP PDF資料下載
參數(shù)資料
| 型號(hào)： | ADN2892ACPZ-RL7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 0K |
| 描述： | IC AMP LIM 16LFCSP |
| 標(biāo)準(zhǔn)包裝： | 1,500 |
| 放大器類型： | 限制 |
| 電路數(shù)： | 1 |
| 輸出類型： | 差分 |
| -3db帶寬： | 1.5GHz |
| 電壓 - 輸入偏移： | 100µV |
| 電流 - 電源： | 48mA |
| 電壓 - 電源，單路/雙路(±)： | 2.9 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 95°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 16-LFCSP-VQ |
| 包裝： | 帶卷 (TR) |
第1頁(yè)第2頁(yè)第3頁(yè)當(dāng)前第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)
ADN2892
Data Sheet
PCB Layout
Figure 19 shows the recommended PCB layout. The 50
transmission lines are the traces that bring the high frequency
input and output signals (PIN, NIN, OUTP, and OUTN) from a
terminated source to a terminated load with minimum
reflection. To avoid a signal skew between the differential
traces, each differential PIN/NIN and OUTP/OUTN pair
should have matched trace lengths from a differential source to
a differential load. C1, C2, C3, and C4 are ac coupling
capacitors in series with the high speed, signal input/output
paths. To minimize the possible mismatch, the ac coupling
capacitor pads should be the same width as the 50
transmission line trace width. To reduce supply noise, a 1 nF
decoupling capacitor should be placed as close as possible to the
VCC pins on the same layer and not through vias. A 0.1 F
decoupling capacitor can be placed on the bottom of the PCB
directly underneath the 1 nF capacitor. All high speed, CML
outputs have internal 50 resistor termination between the
output pin and VCC. The high speed inputs, PIN and NIN, also
have the internal 50 termination to an internal reference
voltage.
As with any high speed, mixed-signal design, keep all high
speed digital traces away from sensitive analog nodes.
Soldering Guidelines for the LFCSP
The lands on the 16-lead LFCSP are rectangular. The PCB pad
for these should be 0.1 mm longer than the package land length
and 0.05 mm wider than the package land width. The land
should be centered on the pad. This ensures that the solder joint
size is maximized. The bottom of the LFCSP has a central
exposed pad. The pad on the printed circuit board should be at
least as large as the exposed pad. Users must connect the
exposed pad to VEE using filled vias so that solder does not
leak through the vias during reflow. This ensures a solid
connection from the exposed pad to VEE.
PAD COATING AND PB-FREE SOLDERING
Table 5.
Pad Coating
Matt-Tin
Pb-Free Reflow Portfolio
J-STD-20B
04986-009
1
FILLED VIAS TO
GND
EXPOSED PAD
PIN
NIN
VIA TO C12, R2
ON BOTTOM
VIAS TO BOTTOM
DOUBLE-VIA TO GND
TO REDUCE INDUCTANCE
C3
C8
C4
C1
C2
OUTP
DOUBLE-VIAS TO REDUCE
INDUCTANCE TO SUPPLY
AND GND
R1, C9, C10 ON BOTTOM
TO ROSA
PLACE C7 ON
BOTTOM OF BOARD
UNDERNEATH C8
OUTN
PLACE C5 ON
BOTTOM OF BOARD
UNDERNEATH C6
4mm
TRANSMISSION LINES SAME
WIDTH AS AC COUPLING
CAPS TO REDUCE REFLECTIONS
GND
AVCC
DVCC GND
C6
Figure 19. Recommended ADN2892 PCB Layout (Top View)
Rev. B | Page 12 of 16
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1445095-9 | CONN HEADER 9POS STR 30GOLD SMD |
| 2038-42-SM-RP | GAS DISCHARGE TUBE |
| 1445095-8 | CONN HEADER 8POS STR 30GOLD SMD |
| OP262TRZ-EP-R7 | IC OPAMP GP R-R 15MHZ DUAL 8SOIC |
| 95736-404LF | CLINCHER R/A LATCHING HEADER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADN2893ACPZ | 功能描述:IC AMP 4.25GBPS LIMITING 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:Excalibur™ 放大器類型:J-FET 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:45 V/µs 增益帶寬積:10MHz -3db帶寬:- 電流 - 輸入偏壓:20pA 電壓 - 輸入偏移:490µV 電流 - 電源:1.7mA 電流 - 輸出 / 通道:48mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 38 V，±2.25 V ~ 19 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| ADN2893ACPZ-R7 | 功能描述:IC AMP 4.25GBPS LIMITING 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 放大器類型:J-FET 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:13 V/µs 增益帶寬積:3MHz -3db帶寬:- 電流 - 輸入偏壓:65pA 電壓 - 輸入偏移:3000µV 電流 - 電源:1.4mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:通孔 封裝/外殼:8-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:8-PDIP 包裝:管件 |
| ADN2905ACPZ | 功能描述:IC CLK/DATA REC 10.3GBPS 24LFCSP 制造商:analog devices inc. 系列:- 包裝:托盤 零件狀態(tài):有效 PLL:是 主要用途:以太網(wǎng) 輸入:CML 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:是/是 頻率 - 最大值:10.3Gbps 電壓 - 電源:1.14 V ~ 3.63 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-WFQFN 裸露焊盤，CSP 供應(yīng)商器件封裝:24-LFCSP-WQ（4x4） 標(biāo)準(zhǔn)包裝:1 |
| ADN2905ACPZ-RL7 | 功能描述:IC CLK/DATA REC 10.3GBPS 24LFCSP 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 PLL:是 主要用途:以太網(wǎng) 輸入:CML 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:是/是 頻率 - 最大值:10.3Gbps 電壓 - 電源:1.14 V ~ 3.63 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-WFQFN 裸露焊盤，CSP 供應(yīng)商器件封裝:24-LFCSP-WQ（4x4） 標(biāo)準(zhǔn)包裝:1 |
| ADN2913ACPZ | 功能描述:IC CLK/DATA REC 8.5GBPS 24-LFCSP 制造商:analog devices inc. 系列:- 包裝:托盤 零件狀態(tài):有效 PLL:是 主要用途:SONET/SDH 輸入:CML 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:1:2 差分 - 輸入:輸出:是/是 頻率 - 最大值:8.5Gbps 電壓 - 電源:1.14 V ~ 3.63 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-WFQFN 裸露焊盤，CSP 供應(yīng)商器件封裝:24-LFCSP（4x4） 標(biāo)準(zhǔn)包裝:1 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。