參數(shù)資料
型號(hào): AFCT-5942AGZ
元件分類(lèi): 光收發(fā)
英文描述: FIBER OPTIC TRANSCEIVER, 1260-1570nm, 2488Mbps(Tx), 2488Mbps(Rx), BOARD/PANEL MOUNT, DIP, LC CONNECTOR
封裝: ROHS COMPLIANT, DIP-20
文件頁(yè)數(shù): 13/18頁(yè)
文件大小: 557K
代理商: AFCT-5942AGZ
4
Package
The overall package concept for the device consists of
the following basic elements; two optical subassemblies,
a electrical subassembly and the housing as illustrated in
the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4 and 5. The details of this package outline and
pin out are compliant with the multisource definition of
the 2 x 10 DIP.
In combination with the metalized nose segment of the
package a metallic nose clip provides connection to
chassis ground for both EMI and thermal dissipation.
The electrical subassembly consists of high volume mul-
tilayer printed circuit boards on which the IC and various
surface-mounted passive circuit elements are attached.
The receiver electrical subassembly includes an internal
shield for the electrical and optical subassembly to en-
sure high immunity to external EMI fields.
The optical subassemblies are attached to the electrical
subassembly. These two units are then fitted within the
outer housing of the transceiver. The housing is then en-
cased with a metal EMI protective shield.
The electrical subassembly carries the signal pins that
exit from the bottom of the transceiver. The solder
posts are designed to provide the mechanical strength
required to withstand the loads imposed on the trans-
ceiver by mating with the LC connectored fiber cables.
Although they are not connected electrically to the
transceiver, it is recommended to connect them to chas-
sis ground.
Figure 3. Block Diagram
DATA OUT
SIGNAL
DETECT
DATA IN
Tx DISABLE
B
MON(+)
B
MON(-)
P
MON(+)
P
MON(-)
QUANTIZER IC
LASER DRIVER
AND CONTROL
CIRCUIT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
DATA OUT
LC
RECEPTACLE
R
X SUPPLY
T
X SUPPLY
R
X GROUND
T
X GROUND
PHOTO DETECTOR
BIAS
LASER BIAS
MONITORING
LASER DIODE
OUTPUT POWER
MONITORING
CASE
*
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
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