參數(shù)資料
型號(hào)： AM41DL6408H8H70IT
廠商： Advanced Micro Devices, Inc.
英文描述： TV 6C 6#20 PIN WALL RECP
中文描述： 堆疊式多芯片封裝（MCP）閃存和SRAM
文件頁數(shù)： 41/66頁
文件大?。?/td> 1123K
代理商： AM41DL6408H8H70IT
November 24, 2003
Am41DL6408H
39
A D V A N C E I N F O R M A T I O N
DC CHARACTERISTICS
Zero-Power Flash
Note:
Addresses are switching at 1 MHz
Figure 10.
I
CC1
Current vs. Time (Showing Active and Automatic Sleep Currents)
25
20
15
10
5
0
0
500
1000
1500
2000
2500
3000
3500
4000
S
Time in ns
10
8
2
0
1
2
3
4
5
Frequency in MHz
S
Note:
T = 25
°
C
Figure 11.
Typical I
CC1
vs. Frequency
2.7 V
3.3 V
4
6
12
相關(guān)PDF資料
PDF描述
AM41DL6408H8H71IS Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:6; Connector Shell Size:11; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
AM41DL6408H8H71IT TV 6C 6#20 PIN WALL RECP
AM41DL6408H8H85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41LV3204MB10IT Stacked Multi-chip Package (MCP) 32 Mbit (4 M x 8 bit/2 M x 16-bit) Flash Memory and 4 Mbit (512K x 8-Bit/256 K x 16-Bit) Static RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM41DL6408H8H71IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41LV3204M 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-chip Package (MCP) 32 Mbit (4 M x 8 bit/2 M x 16-bit) Flash Memory and 4 Mbit (512K x 8-Bit/256 K x 16-Bit) Static RAM
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