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參數(shù)資料
| 型號： | AM41DL6408H |
| 廠商： | Advanced Micro Devices, Inc. |
| 元件分類： | SRAM |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 10/66頁 |
| 文件大?。?/td> | 1123K |
| 代理商： | AM41DL6408H |
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Am41DL6408H
November 24, 2003
A D V A N C E I N F O R M A T I O N
PIN DESCRIPTION
A18–A0
= 19 Address Inputs (Common)
A21–A19, A-1 = 4 Address Inputs (Flash)
SA
= Highest Order Address Pin (SRAM)
Byte mode
DQ15–DQ0
= 16 Data Inputs/Outputs (Common)
CE#f
= Chip Enable (Flash)
CE#s
= Chip Enable (SRAM)
OE#
= Output Enable (Common)
WE#
= Write Enable (Common)
RY/BY#
= Ready/Busy Output
UB#s
= Upper Byte Control (SRAM)
LB#s
= Lower Byte Control (SRAM)
CIOf
= I/O Configuration (Flash)
CIOf = V
IH
= Word mode (x16),
CIOf = V
IL
= Byte mode (x8)
= I/O Configuration (SRAM)
CIOs = V
IH
= Word mode (x16),
CIOs = V
IL
= Byte mode (x8)
= Hardware Reset Pin, Active Low
CIOs
RESET#
WP#/ACC
= Hardware Write Protect/
Acceleration Pin (Flash)
V
CC
f
= Flash 3.0 volt-only single power sup-
ply (see Product Selector Guide for
speed options and voltage supply
tolerances)
V
CC
s
V
SS
NC
= SRAM Power Supply
= Device Ground (Common)
= Pin Not Connected Internally
LOGIC SYMBOL
19
16 or 8
DQ15–DQ0
A18–A0
CE#f
OE#
WE#
RESET#
UB#s
RY/BY#
WP#/ACC
SA
A21–A19, A-1
LB#s
CIOf
CIOs
CE1#s
CE2s
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM41DL6408H8H70IS | TV 6C 6#20 PIN WALL RECP |
| AM41DL6408H8H70IT | TV 6C 6#20 PIN WALL RECP |
| AM41DL6408H8H71IS | Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:6; Connector Shell Size:11; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight |
| AM41DL6408H8H71IT | TV 6C 6#20 PIN WALL RECP |
| AM41DL6408H8H85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM41DL6408H8H70IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H70IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H71IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H71IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H85IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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