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參數(shù)資料
| 型號(hào)： | AM486DXPGA |
| 英文描述： | Am486DX PGA - Am486DX PGA Package Temperature Comparisons |
| 中文描述： | Am486DX美巡賽- Am486DX PGA封裝溫度比較 |
| 文件頁數(shù)： | 52/52頁 |
| 文件大?。?/td> | 1242K |
| 代理商： | AM486DXPGA |
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52
Am486DE2 Microprocessor
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5M-1982.
2. DATUM Plane -A- is located at the mold parting line, and is coincedent with the bottom of the lead where the lead exits the
plastic body.
3. Dimensions “D1" and ”E1" do not include mold protrusions. Allowable protrusion is 0.25mm per side. Dimensions “D1" and ”E1"
include mold mismatch, and are determined at DATUM plane -A-.
4. Dimension “b” does not include DAMBAR protrusion.
5. Controlling dimensions: Millimeter.
6. Dimensions “D” and “E” are measured from outermost points.
7. Pin No. 1 ID may be inside top ejector mark, or separate.
8. Heatsink centerline to be aligned with package centerline
±
0.30.
9. Half span (Center of package to lead tip) shall be 15.30
±
0.165[0.602"
±
0.0065"]
10. No lead distortion (bent leads etc...) shall cause deviation from true position greater than
±
0.04[0.0016"] at “b max”.
11. Lead coplanarity with respect to the seating plane shall not exeed 0.08[0.0031"].
AMD, the AMD logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
Am386, and Am486 are registered trademarks of Advanced Micro Devices, Inc.
FusionE86 is a service mark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
0.10
0.20
Gage Plane
0.25
0.20
±
0.10
0
°
Min.
0.40 Min. Flat Shoulder
12~ 16
°
12~ 16
°
0
°
-7
°
10
11
0.08
4
4.00
Detail H
0.50
0.75
1.30
Nom.
Section S-S
0.17
0.27
0.17
0.27
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|---|---|
| AM486DXSQFP | 70NS, PLCC, IND TEMP(EEPROM) |
| AM486 | Am486 Microprocessor Software User＇s Manual? 4.40MB (PDF) |
| AM49DL3208G | Am49DL3208G - Stacked Multi-Chip Package (MCP) Flash Memory and pSRAM |
| AM49DL320BG | Am49DL320BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL32XBG | Am49DL32xBG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM486DXSQFP | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Am486DX SQFP - Am486DX SQFP Package Temperature Comparisons |
| AM486-EVAL-KIT | 制造商:Advanced Micro Devices 功能描述:AM486CDP EVAL KIT |
| AM4874N | 制造商:ANALOGPOWER 制造商全稱:ANALOGPOWER 功能描述:N-Channel 30-V (D-S) MOSFET |
| AM4890N | 制造商:ANALOGPOWER 制造商全稱:ANALOGPOWER 功能描述:Dual N-Channel 150-V (D-S) MOSFET |
| AM4892N | 制造商:ANALOGPOWER 制造商全稱:ANALOGPOWER 功能描述:Dual N-Channel 150-V (D-S) MOSFET |
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