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Physical Dimensions of the AMD-K5 Processor

20092B/0—Sep1996

AMD-K5 Processor Thermal Considerations

Both the ceramic and the ceramic thermal slug PGA packages

have the same overall dimensions (see Figure 7A and Figure

7B). Thus, the same cooling solution can be used for both pro-

cessor packages. The heat sink clip that mechanically attaches

the heat sink and processor to the processor ZIF socket is not

affected by the package. The thermal interface layer (i.e., the

silicon grease) has a cross sectional area of 3.8 square inches

(1.95 inch squared) for the ceramic package, and 1.56 square

inches (1.25 inch squared) for the ceramic thermal slug pack-

age. The copper slug has greater thermal conductivity than

the ceramic package, allowing the processor junction to oper-

ate at a lower temperature for the same power levels. Vibra-

tion and shock testing have shown that the same heat sink clips

perform equally for both processor packages.

相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
AMD-K5-PR133ABQ	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
AMD-K5-PR133ABR	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
AMD-K5-PR166ABX	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
AMD-K5-PR75ABR	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
AMD-K5-PR90ABQ	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor

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