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AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
Conclusion (Final Checklist)
When selecting a cooling solution for the AMD-K5 processor it
is important to know the following:
1. Maximum operating clock frequency and maximum case
temperature for the processor. Check the OPN and data
sheet for the latest information.
2. Thermal specification of the desktop personal computer for
both the maximum case inside temperature (e.g., 30
o
C) and
the airflow above the processor socket on the motherboard
(200 lfpm).
3. Select a heat sink or heat sink/fan module that assures a
safe thermal margin (see
Heat Sink Equations
on page 4)
and that fits within the maximum size requirements with a
secure mechanical attachment (e.g., heat sink clip or ther-
mal adhesive tape) to withstand the vibration and shock
requirements of a personal computer system.
4. Select fans that have sealed ball bearings to ensure long life
(e.g., greater than 5 years).
5. Make sure that there are no mechanical restrictions above a
fan heat sink module (e.g., 0.5 in or more).
6. If thermal adhesive tape is used, the following items should
be specified: the tape should be approximately 0.006 and
the top of the ceramic case should be primed to ensure max-
imum bond strength (see
Thermal Adhesive Tape
on page
15).
7. Thermal system measurements are required to ensure that
the processor case doesn’t exceed the maximum case tem-
perature specification (lower case temperatures ensure safe
thermal margins).