參數(shù)資料
型號: AMD-K7550MTR51BA
元件分類: 微處理器
英文描述: MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC
中文描述: 微處理器| 32位|的CMOS |卡|塑料
文件頁數(shù): 13/44頁
文件大?。?/td> 2886K
代理商: AMD-K7550MTR51BA
Heat Sinks
5
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
I
θ
jc
is the thermal resistance from junction to case
θ
cs
is the thermal resistance from case to heat sink
θ
sa
is the thermal resistance from heat sink to ambient air
I
I
The above relationship can also be stated in the following
forms:
Equation 3 P
max
= (T
c
- T
a
) / (
θ
cs
+
θ
sa
)
Equation 4 P
max
= (T
s
- T
a
) / (
θ
sa
)
where
I
T
c
is the case temperature of the AMD-K5 processor
T
s
is the heat sink temperature
I
The heat sink selection process requires knowledge of the fol-
lowing system variables:
I
Available volume of space to be occupied without interfer-
ence of other system components (e.g., personal computer
expansion cards, side walls of enclosure, peripherals,
cables, etc.)
The maximum allowable device junction temperature of
the processor die
The maximum power dissipation of the processor
The device configuration (package size and orientation of
the package)
Ambient conditions (temperature, air velocity, and airflow
direction)
I
I
I
I
Types of Heat Sinks
The most frequently used heat sinks for processor cooling
applications are discussed in the following sections. These heat
sinks are designed to transfer heat from the processor into the
air inside a personal computer case. Several manufacturers
offer standard, cost effective, aluminum products (e.g.,
extruded, pin fin, die cast), composition products, and custom
products. Each heat sink should have the following items spec-
ified: thermal resistance (i.e., natural and forced air), size
(length, width, and height), and weight. Many heat sink prod-
uct families have one standard shape and varying heights
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