參數(shù)資料
型號: AMD-K7550MTR51BA
元件分類: 微處理器
英文描述: MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC
中文描述: 微處理器| 32位|的CMOS |卡|塑料
文件頁數(shù): 25/44頁
文件大?。?/td> 2886K
代理商: AMD-K7550MTR51BA
The AMD-K5 Processor Thermal and Power Specifications
17
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
The AMD-K5
Processor Thermal and Power Specifications
Table 4 contains target data believed to be accurate, but con-
sult the AMD-K5 processor data sheet for the latest
specifications.
Physical Dimensions of the AMD-K5 Processor
This section defines the mechanical specification for the
AMD-K5 processor case, shown in Figure 7A and Figure 7B.
The top of the ceramic package, approximately 4 square inches
in area, is where the primary heat transfer occurs. Very little
heat transfers from the bottom or sides of the package. The
thermal interface is applied to the top of the package and care
should be taken not to get foreign material on the interface or
the heat sink surface.
Note:
Use the information in Figure 7A and Figure 7B for thermal
reference only.
Table 4. Operating Range of the AMD-K5 Processor
Symbol
Parameter
Description
Min.
Typical
Max.
Comments
T
case
Case Temperature
0
o
C
70
o
C
Temperature measured at the
top center of case
V
cc
= 3.3 V +/- 5%
V
cc
= 3.6 V
V
cc
= 3.3 V
V
cc
I
cc
I
cc
Power Supply Voltage
3.135 V
3.465 V
Power Supply Current
44 mA / MHz
Power Supply Current
36 mA / MHz
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