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參數(shù)資料
| 型號(hào)： | AMI304 |
| 廠商： | AICHI MICRO INTELLIGENT CORP |
| 元件分類： | 磁阻傳感器 |
| 英文描述： | MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, -.6-0.6mT, RECTANGULAR, SURFACE MOUNT |
| 文件頁(yè)數(shù)： | 29/37頁(yè) |
| 文件大?。?/td> | 530K |
| 代理商： | AMI304 |
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AMI304 Specifications
35/37
Ver.B9100812
[ 17 ] Reliability Test Conditions
No.
Test Item
Test Condition
[In accordance to EIAJ ED-4701 ]
＊
1.
Preparation
Test-
Time
n(C=0)
[LTPD]
Criterion
1
High Temp. Storage
Ta= +105
°C
No
500 hours 22[10％]
2
Low Temp. Storage
Ta= -40
°C
No
500 hours 22[10％]
3
Temperature Humidity
Storage
Ta= +85
°C, RH= 85%
1) + 2)
500 hours 22[10％]
4
High Temp. Bias
Ta= +105
°C, VDD= +3.6V
No
500 hours 22[10％]
5
High Temp. Humidity
Bias
Ta= +85
°C, RH= 85%,
VDD= +3.6V
1) + 2)
500 hours 22[10％]
6
Temperature
Cycle Test
-40
°C +105°C
(30min－5min－30min)
1) + 2)
10 cycles 22[10％]
7
Thermal shock
-40
°C +105°C
(5min－10s－5min)
1) + 2)
10 cycles 22[10％]
8
Solder Heat Resistance Infrared Reflow（See graph below:
High temp. Reflow peak is below
260
°C）
1)
3 times
22[10％]
9
ESD Sensitivity
C= 100pF, R= 1.5k ohm, ±2kV
(Min.)
No
3 times
22[10％]
Change rate of the
electro-magnetic
characteristics
must be less than
±
20% .
10 CDM Sensitivity
±
500V
No
1 time
22[10％]
11 Circuit Board Flex
Support Span 90mm, Flex 3mm、
5±1second hold
No
1 time
22[10％]
12 Solder ability
Ta= +235
°C
3)
3 seconds 22[10％] Covered with solder
more than 95% of
the dipped portion
of the terminal.
13 Sensor Body Strength
R0.5 pressure jig, 10N、10±1sec
hold
No
1 time
22[10％] Mechanical
Characteristics
［
Preparation conditions］（Ref.: EIAJ ED4701-2 B101A）
1) Saturation Humidification processing:
(Ta= +85°C, RH= 30%, t= 168 hours, + Ta= +30°C, RH= 70%, t= 168 hours)
2) Infrared Reflow (continuously for 3 times)
3) Water vapor aging (4 hours）
Fig.1. Infrared Reflow Heating Conditions
Temp [
° C]
Time
180±10° C
250° C
260° C
Inside 30s
120
±30s
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