參數(shù)資料
型號(hào)： AMI304
廠商： AICHI MICRO INTELLIGENT CORP
元件分類(lèi)： 磁阻傳感器
英文描述： MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, -.6-0.6mT, RECTANGULAR, SURFACE MOUNT
文件頁(yè)數(shù)： 30/37頁(yè)
文件大?。?/td> 530K
代理商： AMI304
AMI304 Specifications
36/37
Ver.B9100812
[ 18 ] Solder reflow condition
Solder reflow condition is shown below.
Repair should be carried out with following conditions : +250～+270℃×within 30 sec.
Heating time + within 150 sec. (Including preheating time 70sec.)
In case moisture absorbent products are used, the repair should be carried out after baking.
[ 19 ] Notes
1) This device uses a C-MOS IC. Please take precautions to prevent damage due to electrical static
discharge.
2) In order to obtain stable operation please place a X5R ceramic capacitor (capacity more than 0.47μF)
between AVDD-GND and a X5R ceramic capacitor (capacity more than 0.01μF) between
DVDD-GND. Please set these capacitors in neighborhood to the pins.
3) The writing pattern to AVDD and GND should be as wide as possible in order to reduce high
frequency impedance.
4) Please make short-circuit between GNDA and GNDS pins with thick and short wiring.
5) Storage Method (moisture-proof and packed condition)
a) Please do not leave the device in the following environments:
* High temperature and high humidity
* Places with direct sun light
* Places with extreme temperature changes
* Dusty places
* In corrosive gas
b) Recommended storage temperature and humidity:
* +5℃～+30℃, below 70%RH, please use device within one year.
(If the device does not use over one year, the specification may not be satisfied.)
6) Usage after opening the moisture-proof package
a) Please apply devices within 7days under the condition of +5℃～+30℃、below 70％RH.
The storage in the moisture-proof room (+5℃～+30℃、below 30％RH) is recommended.
b) When the devices storage in the moisture- proof room (+30℃、below10％RH), please apply them
within 1 year.
①
②
③
Te
mperat
ure
(
℃
)
①
Preheating：（+150～+190℃）×（90±30sec.）
②
+220℃ marginal zone：20～50sec.
③
Heating：+235～+250℃ peak（within
10sec.）
④
Heating environment：air or N2
⑤
Number of Reflow times：２
Fig.2. Solder reflow condition
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