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AMIS-30623 LIN Microstepping Motordriver
Data Sheet
20.0 Soldering
20.
ace Mount Packages
1 Introduction to Soldering Surf
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
ndbook IC26; Integrated Circuit Packa
Ha
ges” (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount
it boar
ICs, or for printed-circu
ds with high population densities. In these situations reflow soldering is often used.
20.2 Re
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re
e
Throughput time
Typical re-flow peak te
below 230°C.
flowing; for
xample, infrared/convection heating in a conveyor type oven.
s (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
mperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept
ve Soldering
soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
omponent density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave
oldering method was specifically developed.
wave soldering is used the following conditions must be observed for optimal results:
ldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar
Use a double-wave so
wave.
For packages with leads o
n two sides and a pitch (e):
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
d-circuit board;
7mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit
int must incor
e downstream end.
For pack
four sides,
circuit bo
ust incorpor
s downstream and at the side corners.
rint m
ve
ard. The footp
ate solder thie
ced at a 45o angle to the transport direction of the printed-
ust be pla
uring placement and before soldering, the pack ge must be fixed with a droplet of adhesive. The adhesive can be applied by screen
inting, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
ypical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most
pplications.
a
0.4 Manual Soldering
2
ix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
art of the lead. Contact time must be limited to 10 seconds at up to 300°C.
hen using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
W
Table 39: Soldering Process
-flow Soldering
20.3 Wa
Conventional single wave
c
s
If
the printe
o
Smaller than 1.2
board. The fo
ages with leads on
otpr
porate solder thieves at th
the footprint m
D
pr
T
F
p
Soldering Method
Package
Wave
Not suitable
Reflow(1)
Suitable
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
Not suitable (2)
Suitable
Suitable
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4) Suitable
SSOP, TSSOP, VSO
Not recommended (5)
Suitable
66
AMI Semiconductor
– June 2006, Rev 3.0
www.amis.com