參數(shù)資料
型號(hào): AMIS-30663
元件分類: CAN
英文描述: High Speed CAN Transceiver
中文描述: 高速CAN收發(fā)器
文件頁數(shù): 12/12頁
文件大?。?/td> 222K
代理商: AMIS-30663
12
AMI Semiconductor - Rev. 1.4, Oct. 04
www.amis.com
AMIS-30663
High Speed CAN Transceiver
Data Sheet
Table 8: Soldering Process
Package
Soldering Method
Wave
Not suitable
Not suitable (2)
Suitable
Not recommended (3)(4)
Not recommended (5)
Reflow (1)
Suitable
Suitable
Suitable
Suitable
Suitable
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information
in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods."
2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick
to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream
and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or
smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or
smaller than 0.5mm.
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to
discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional
processing by AMIS for such applications. Copyright 2005 AMI Semiconductor, Inc.
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