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參數(shù)資料
| 型號： | AMMC-5033 |
| 元件分類： | 放大器 |
| 英文描述： | 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 0.108 X 0.0516 INCH, 0.004 INCH HEIGHT, DIE |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 325K |
| 代理商： | AMMC-5033 |
7
Biasing and Operation
The recommended quiescent DC bias condition for
optimum efficiency, performance, and reliability is
Vd1 = 3.5 volts and Vd2 = 5 volts with Vgg set for
Id1 + Id2 = 780 mA (no connection to Vg1). This bias
arrangement results in default quiescent drain currents
Id1 = 280 mA, Id2 = 500 mA. A single DC gate supply
connected to Vgg will bias all gain stages.
If operation with both Vd1 and Vd2 at 5 volts is desired,
an additional wire bond connection from the Vg1 pad to
Vgg external bypass chip capacitor (shorting Vg1 to Vgg)
will balance the current in each gain stage. Vgg (= Vg1)
can be adjusted for Id1 + Id2 = 780 mA. Muting can
be accomplished by setting Vg1 and/or Vgg to the pinch-
off voltage Vp.
An optional output power detector network is also pro-
vided. Detector sensitivity can be adjusted by biasing
the diodes with typically 1 to 5 volts applied to the
Det- bias terminal. Simply connecting Det-Bias to the Vd2
supply is a convenient method of biasing this detector
network. The differential voltage between the Det-Ref
and Det-Out pads can be correlated with the RF power
emerging from the RF output port. The detected volt-
age is given by:
V = (Vref - Vdet) - Vofs
Where Vref is the voltage at the DET_REF port, Vdet is
avoltage at the DET_OUT port, and Vofs is the zero-in-
put-power offset voltage. There are three methods to
calculate Vofs:
1. Vofs can be measured before each detector measure-
ment (by removing or switching off the power source
and measuring Vref - Vdet ). This method gives an error
due to temperature drift of less than 0.0002 dB/
°C.
2. Vofs can be measured at a single reference tempera-
ture. The drift error will be less than 0.25 dB.
3. Vofs can either be characterized over temperature and
stored in a lookup table, or it can be measured at two
temperatures and a linear fit used to calculate Vofs at
any temperature. This method gives an error close to
method #1.
With reference to Figure 13, the RF input is DC coupled
to a shunt 50
resistor but it is DC blocked to the input
of the first stage. The RF output is DC blocked to the
output of the second stage, however, it is DC coupled to
the detector bias circuit. If the output detector is biased
using the on-chip optional Det-Bias network, an external
DC blocking capacitor may be required at the RF Output
port.
No ground wires are needed since ground connections
are made with plated through-holes to the backside of
the device.
Assembly Techniques
The backside of the AMMC- 5033 chip is RF ground. For
microstripline applications, the chip should be attached
directly to the ground plane (e.g., circuit carrier or
heatsink) using electrically conductive epoxy.[1]
For best performance, the topside of the MMIC should
be brought up to the same height as the circuit sur-
rounding it. This can be accomplished by mounting a
gold plated metal shim (same length and width as the
MMIC) under the chip, which is of the correct thickness
to make the chip and adjacent circuit coplanar.
The amount of epoxy used for chip and or shim attach-
ment should be just enough to provide a thin fillet
around the bottom perimeter of the chip or shim. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment.
The location of the RF bond pads is shown in Figure 14.
Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is sufficient for
signal connections, however double-bonding with 0.7 mil
gold wire or the use of gold mesh[2] is recommended for
best performance, especially near the high end of the
frequency range.
Thermosonic wedge bonding is the preferred method
for wire attachment to the bond pads. Gold mesh can be
attached using a 2 mil round tracking tool and a tool
force of approximately 22 grams with an ultrasonic power
of roughly 55 dB for a duration of 76
± 8 mS. A guided
wedge at an ultrasonic power level of 64 dB can be used
for the 0.7 mil wire. The recommended wire bond stage
temperature is 150
± 2°C.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100
m thick and should be handled with
care. This MMIC has exposed air bridges on the
top surface and should be handled by the edges or with
a custom collet (do not pick up die with vacuum on die
center.)
This MMIC is also static sensitive and ESD handling
precautions should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| AMMC-5033-W10 | 功能描述:射頻放大器 Amp GaAs MMIC RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-5033-W50 | 功能描述:射頻放大器 Amp GaAs MMIC RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-5040 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:20-45 GHz GaAs Amplifier |
| AMMC-5040-W10 | 功能描述:射頻放大器 20 - 45 GHz 25 dB RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-5040-W50 | 功能描述:射頻放大器 20 - 45 GHz 25 dB RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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