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參數(shù)資料
| 型號(hào)： | AMMC-6530-W10 |
| 元件分類： | 混頻器 |
| 英文描述： | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 8 dB CONVERSION LOSS-MAX |
| 封裝： | 1.30 X 1.40 MM, DIE |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 310K |
| 代理商： | AMMC-6530-W10 |
7
Biasing and Operation
The recommended DC bias condition for optimum
performance, and reliability is Vg = -1 volts. This can be
applied to either of the two Vg connections as they are
internally connected. There is no current consumption
for the gate biasing because the FET mixer was designed
for passive operation. For down conversion, the
AMMC-6530 may be configured in a low loss or high
linearity application. In a low loss configuration, the
LO is applied through the drain. In this configuration,
the AMMC-6530 is a “drain pumped mixer”. For higher
linearity applications, the LO is applied through the gate.
In this configuration, the AMMC-6530 is a “gate pumped
mixer” (or Resistive mixer). The mixer is also suitable for
up-conversion applications under the gate pumped
mixer operation shown on page 5.
Please note that the image rejection and isolation
performance is dependent on the selection of the
low frequency quadrature hybrid. The performance
specification of the low frequency quadrature hybrid as
well as the phase balance andVSWR of the interface to the
AMMC-6530 will affect the overall mixer performance.
Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to
the ground plane (e.g. circuit carrier or heatsink) using
electrically conductive epoxy[1, 2].
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plate
metal shim (same length and width as the MMIC) under
the chip which is of correct thickness to make the chip
and adjacent circuit the same height. The amount of
epoxy used for the chip and/or shim attachment should
be just enough to provide a thin fillet around the bottom
perimeter of the chip or shim. The ground plane should
be free of any residue that may jeopardize electrical or
mechanical attachment.
Figure21.SimplifiedMMICSchematic.
Figure22.AMMC-6530BondPadlocations.
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| AMMP-6530 | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 10 dB CONVERSION LOSS-MAX |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMC-6530-W50 | 功能描述:射頻混合器 Mixer MMIC 6-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6545 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 to 45 GHz Sub - Harmonic Mixer LO Frequency: 9-24GHz |
| AMMC-6545-W10 | 功能描述:射頻混合器 Mixer 18-33GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6545-W50 | 功能描述:射頻混合器 Mixer 18-33GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6550-W10 | 功能描述:上下轉(zhuǎn)換器 Image Rejection Mixr 15-50GHz RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
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