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參數(shù)資料
| 型號： | AMMC-6530-W10 |
| 元件分類： | 混頻器 |
| 英文描述： | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 8 dB CONVERSION LOSS-MAX |
| 封裝： | 1.30 X 1.40 MM, DIE |
| 文件頁數(shù)： | 8/8頁 |
| 文件大小： | 310K |
| 代理商： | AMMC-6530-W10 |
The location of the RF bond pads is shown in Figure
23. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
seriesinductance.Asinglebondwireisnormallysufficient
for signal connections, however double bonding with 0.7
mil gold wire or use of gold mesh is recommended for
best performance, especially near the high end of the
frequency band. Thermosonic wedge bonding is the
preferred method for wire attachment to the bond pads.
Gold mesh can be attached using a 2 mil round tracking
tool and a tool force of approximately 22 grams and a
ultrasonic power of roughly 55 dB for a duration of 76±8
mS. The guided wedge at an untrasonic power level of 64
dB can be used for 0.7 mil wire. The recommended wire
bond stage temperature is 150±2°C. Caution should be
taken to not exceed the Absolute Maximum Rating for
assembly temperature and time.
The chip is 100 m thick and should be handled with
care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
This MMIC is also static sensitive and ESD precautions
should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability
of the device.
Figure23.AMMC-6530AssemblyDiagram.
Part Number Ordering Information
PartNumber
DevicesperContainer
AMMC-6530-W10
10
AMMC-6530-W50
50
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, AvagoTechnologies, and the A logo are trademarks of AvagoTechnologies, Limited in the United States and other countries.
Data subject to change. Copyright 2008 AvagoTechnologies, Limited. All rights reserved. Obsoletes 5989-395EN
AV02-1293EN May 25, 2008
RF/LO
LO/RF
Vg
Gnd
IF1
IF2
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| AMMP-6530 | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 10 dB CONVERSION LOSS-MAX |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMC-6530-W50 | 功能描述:射頻混合器 Mixer MMIC 6-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6545 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 to 45 GHz Sub - Harmonic Mixer LO Frequency: 9-24GHz |
| AMMC-6545-W10 | 功能描述:射頻混合器 Mixer 18-33GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6545-W50 | 功能描述:射頻混合器 Mixer 18-33GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6550-W10 | 功能描述:上下轉(zhuǎn)換器 Image Rejection Mixr 15-50GHz RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
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