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參數(shù)資料
| 型號： | AMMP-6120 |
| 元件分類： | 倍頻器 |
| 英文描述： | 4000 MHz - 12000 MHz RF/MICROWAVE FREQUENCY DOUBLER |
| 封裝： | 5 X 5 MM, SURFACE MOUNT PACKAGE-8 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 266K |
| 代理商： | AMMP-6120 |
Refer the Absolute Maximum Ratings table for allowed DC and
thermal conditions
Outline Drawing
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Agilent Technologies releases this product
for general sales, Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability
of the product(s) at anytime.
Revision Date: 4/28/04
Revision Number: 5.0
Suggested PCB Material and Land Pattern
Evaluation Test Circuit (Demo Board)
(Available to customer on qualified request)
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in the
data sheet, optimizes RF performance and is strongly
recommended. An electronic drawing of the land pattern
is available from www.agilent.com/view/rf or upon request
from Agilent Application Engineering.
Manual Assembly for Prototypes
1.
Follow ESD precautions while handling packages.
2.
Handling should be along the edges with tweezers or
from topside if using a vacuum collet.
3.
Recommended attachment is solder paste. Please see
recommended solder reflow profile. Conductive
epoxy is not recommended. Hand soldering is not
recommended.
4.
Apply solder paste using either a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will
degrade RF performance.
NOTES:
1.
INIDICATES PIN 1
2.
DIMENSIONS ARE IN
INCHES [MILIMETERS]
3.
ALL GROUNDS MUST BE
SOLDERED TO PCB RF
GROUND
5.
Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temperature to avoid
damage due to thermal shock.
6.
Packages have been qualified to withstand a peak
temperature of 235
°C for 15 seconds. Verify that the
profile will not expose device beyond these limits.
7.
Clean off flux per vendor’s recommendations.
8.
Clean the module with Acetone. Rinse with alcohol.
Allow the module to fully dry before testing.
25
75
125
175
225
0
1
23
4
5
67
8
TIM E (minutes)
Temperature
(
°
C
)
Recommended solder reflow profile
For product information and a complete list of Agilent
contacts and distributors, please go to our website:
www.agilent.com/semiconductors
E-mail: SemiconductorSupport@agilent.com
Data subject to change.
Copyright 2004 Agilent Technologies, Inc.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6120-BLK | 功能描述:射頻無線雜項(xiàng) 8-24 GHz 18 dB RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6120-TR1 | 功能描述:射頻無線雜項(xiàng) Doubler MMIC 6-20GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6120-TR2 | 功能描述:射頻無線雜項(xiàng) Doubler MMIC 6-20GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6125-BLKG | 功能描述:射頻放大器 6-13 GHzFreq Mult RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6125-TR1G | 功能描述:射頻放大器 6-13 GHzFreq Mult RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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