ProASICPLUS Flash Family FPGAs v5.9 2-31 Operating Conditions Table 2-17 and Tab" />
參數資料
型號: APA300-FGG256I
廠商: Microsemi SoC
文件頁數: 115/178頁
文件大?。?/td> 0K
描述: IC FPGA PROASIC+ 300K 256-FBGA
標準包裝: 90
系列: ProASICPLUS
RAM 位總計: 73728
輸入/輸出數: 186
門數: 300000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 256-LBGA
供應商設備封裝: 256-FPBGA(17x17)
ProASICPLUS Flash Family FPGAs
v5.9
2-31
Operating Conditions
Table 2-17 and Table 2-18 delineate operating limits.
Performance Retention
For devices operated and stored at 110°C or less, the
performance
retention
period
is
20
years
after
programming. For devices operated and stored at
temperatures greater than 110°C, refer to Table 2-19 on
page 2-32 to determine the performance retention
period. Actel does not guarantee performance if the
performance retention period is exceeded. Designers can
determine the performance retention period from the
following table.
Evaluate the percentage of time spent at the highest
temperature,
then
determine
the
next
highest
temperature to which the device will be exposed. In
Table 2-19 on page 2-32, find the temperature profile
that most closely matches the application.
Example – the ambient temperature of a system cycles
between 100°C (25% of the time) and 50°C (75% of the
time). No forced ventilation cooling system is in use. An
APA600-PQ208M
FPGA
operates
in
the
system,
dissipating
1 W.
The
package
thermal
resistance
(junction-to-ambient) in still air Θja is 20°C/W, indicating
that the junction temperature of the FPGA will be 120°C
(25% of the time) and 70°C (75% of the time). The entry
in Table 2-19 on page 2-32, which most closely matches
the application, is 25% at 125°C with 75% at 110°C.
Performance retention in this example is at least 16.0
years.
Note that exceeding the stated retention period may
result in a performance degradation in the FPGA below
the worst-case performance indicated in the Actel Timer.
To ensure that performance does not degrade below the
worst-case values in the Actel Timer, the FPGA must be
reprogrammed
within
the
performance
retention
period. In addition, note that performance retention is
independent of whether or not the FPGA is operating.
The retention period of a device in storage at a given
temperature will be the same as the retention period of
a device operating at that junction temperature.
Table 2-17 Absolute Maximum Ratings*
Parameter
Condition
Minimum
Maximum
Units
Supply Voltage Core (VDD)–0.3
3.0
V
Supply Voltage I/O Ring (VDDP)–0.3
4.0
V
DC Input Voltage
–0.3
VDDP + 0.3
V
PCI DC Input Voltage
–1.0
VDDP + 1.0
V
PCI DC Input Clamp Current (absolute)
VIN < –1 or VIN = VDDP + 1 V
10
mA
LVPECL Input Voltage
–0.3
VDDP + 0.5
V
GND
00
V
Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to
absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the
Recommended Operating Conditions.
Table 2-18 Programming, Storage, and Operating Limits
Product Grade
Programming Cycles (min.)
Program Retention (min.)
Storage Temperature
Operating
Min.
Max.
TJ Max.
Junction
Temperature
Commercial
500
20 years
–55°C
110°C
Industrial
500
20 years
–55°C
110°C
Military
100
–65°C
150°C
MIL-STD-883
100
–65°C
150°C
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