ProASICPLUS Flash Family FPGAs v5.9 2-27 Package Thermal Characteristics
參數(shù)資料
型號： APA750-FG896A
廠商： Microsemi SoC
文件頁數(shù)： 110/178頁
文件大小： 0K
描述： IC FPGA PROASIC+ 750K 896-FBGA
標準包裝： 27
系列： ProASICPLUS
RAM 位總計： 147456
輸入/輸出數(shù)： 562
門數(shù)： 750000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 896-BGA
供應(yīng)商設(shè)備封裝： 896-FBGA（31x31）
ProASICPLUS Flash Family FPGAs
v5.9
2-27
Package Thermal Characteristics
The ProASICPLUS family is available in several package
types with a range of pin counts. Actel has selected
packages based on high pin count, reliability factors, and
superior thermal characteristics.
Thermal resistance defines the ability of a package to
conduct heat away from the silicon, through the
package to the surrounding air. Junction-to-ambient
thermal resistance is measured in degrees Celsius/Watt
and is represented as Theta ja
(Θja). The lower the
thermal resistance, the more efficiently a package will
dissipate heat.
A package’s maximum allowed power (P) is a function of
maximum junction temperature (TJ), maximum ambient
operating temperature (TA), and junction-to-ambient
thermal resistance Θja. Maximum junction temperature is
the maximum allowable temperature on the active
surface of the integrated circuit (IC) and is 110°C. P is
defined as shown in
EQ 2-4
Θ
ja is a function of the rate (in linear feet per minute
(lfpm)) of airflow in contact with the package. When the
estimated power consumption exceeds the maximum
allowed power, other means of cooling, such as
increasing the airflow rate, must be used. The maximum
power dissipation allowed for a Military temperature
device is specified as a function of Θjc. The absolute
maximum junction temperature is 150°C.
The calculation of the absolute maximum power
dissipation
allowed
for
a
Military
temperature
application is illustrated in the following example for a
456-pin PBGA package:
EQ 2-5
P
T
J
T
A
–
Θ
ja
-----------------
=
Table 2-16 Package Thermal Characteristics
Plastic Packages
Pin Count
θ
jc
θ
ja
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14.0
33.5
27.4
25.0
°C/W
Thin Quad Flat Pack (TQFP)
144
11.0
33.5
28.0
25.7
°C/W
Plastic Quad Flat Pack (PQFP)1
208
8.0
26.1
22.5
20.8
°C/W
PQFP with heat spreader2
208
3.8
16.2
13.3
11.9
°C/W
Plastic Ball Grid Array (PBGA)
456
3.0
15.6
12.5
11.6
°C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)3
484
3.2
18.0
14.7
13.6
°C/W
Fine Pitch Ball Grid Array (FBGA)4
484
3.2
20.5
17.0
15.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
676
3.2
16.4
13.0
12.0
°C/W
Fine Pitch Ball Grid Array (FBGA)
896
2.4
13.6
10.4
9.4
°C/W
Fine Pitch Ball Grid Array (FBGA)
1152
1.8
12.0
8.9
7.9
°C/W
Ceramic Quad Flat Pack (CQFP)
208
2.0
22.0
19.8
18.0
°C/W
Ceramic Quad Flat Pack (CQFP)
352
2.0
17.9
16.1
14.7
°C/W
Ceramic Column Grid Array (CCGA/LGA)
624
6.5
8.9
8.5
8.0
°C/W
Notes:
1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300
2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000
3. Depopulated array
4. Full array
Maximum Power Allowed
Max. junction temp. (
°C) Max. case temp. (°C)
–
θ
jc(°C/W)
-----------------------------------------------------------------------------------------------------------------------------
150
°C125°C
–
3.0
°C/W
----------------------------------------
8.333W
=
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
APA750-FG896I 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
APA750-FGB 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGG676 功能描述:IC FPGA PROASIC+ 750K 676-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
APA750-FGG676I 功能描述:IC FPGA PROASIC+ 750K 676-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
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