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參數(shù)資料
| 型號： | ASDL-3212-021 |
| 廠商： | LITE-ON ELECTRONICS INC |
| 元件分類： | 其它接口 |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, DMA6 |
| 封裝： | 7 X 2.73 MM, 1.64 MM HEIGHT, MINIATURE PACKAGE-6 |
| 文件頁數(shù)： | 2/17頁 |
| 文件大?。?/td> | 542K |
| 代理商： | ASDL-3212-021 |
0
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different DT/Dtime tem-
perature change rates. The DT/Dtime rates are detailed
intheabovetable.Thetemperaturesaremeasuredatthe
componenttoprintedcircuitboardconnections.
In process zone P1, the PC board and ASDL-3212 cas-
tellation pins are heated to a temperature of 160°C to
activate the flux in the solder paste. The temperature
rampuprate,R1,islimitedto3°Cpersecondtoallowfor
evenheatingofboththePCboardandASDL-3212castel-
lations.
Process zone P2shouldbeofsufficienttimeduration(60
to120seconds)todrythesolderpaste.Thetemperature
is raised to a level just below the liquidus point of the
solder,usually200°C(392°F).
Recommended Reflow Profile
Process Zone
Symbol
DT
Maximum DT/Dtime
Heat Up
P, R
25°C to 60°C
3°C/s
Solder Paste Dry
P2, R2
60°C to 200°C
0.5°C/s
Solder Reflow
P3, R3
P3, R4
200°C to 255°C (260°C at 0 seconds max)
255°C to 200°C
4°C/s
-6°C/s
Cool Down
P4, R5
200°C to 25°C
-6°C/s
Process zone P3 is the solder reflow zone. In zone P3,
the temperature is quickly raised above the liquidus
pointofsolderto255°C(491°F)foroptimumresults.The
dwelltimeabovetheliquiduspointofsoldershouldbe
between 20 and 60 seconds. It usually takes about 20
seconds to assure proper coalescing of the solder balls
intoliquidsolderandtheformationofgoodsoldercon-
nections. Beyond a dwell time of 60 seconds, the inter-
metallicgrowthwithinthesolderconnectionsbecomes
excessive, resulting in the formation of weak and un-
reliable connections. The temperature is then rapidly
reducedtoapointbelowthesolidustemperatureofthe
solder, usually 200°C (392°F), to allow the solder within
theconnectionstofreezesolid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
boardandASDL-3212castellationstochangedimensions
evenly,puttingminimalstressesontheASDL-3212trans-
ceiver.
50
100
150
200
250
300
t-TIME
(SECONDS)
25
80
120
160
180
200
230
255
0
T
-T
E
M
P
E
R
AT
U
R
E
(°
C
)
R1
R2
R3
R4
R5
220
MAX 260C
60 s ec
MAX
Above 220 C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
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