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| 型號： | ASDL-3212-021 |
| 廠商： | LITE-ON ELECTRONICS INC |
| 元件分類： | 其它接口 |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, DMA6 |
| 封裝： | 7 X 2.73 MM, 1.64 MM HEIGHT, MINIATURE PACKAGE-6 |
| 文件頁數(shù)： | 3/17頁 |
| 文件大?。?/td> | 542K |
| 代理商： | ASDL-3212-021 |
Figure A2. Land Pattern
Recommended land pattern
Figure A1. Stencil and PCBA
Appendix A: ASDL-3212 (Option -021) SMT Assembly Application Note
Solder Pad, Mask and Metal Stencil
fiducial
0.60
0.95
0.10
Mounting
Center
Unit: mm
CL
Pitch
1.425
2.375
1.75
0.775
Solder
Mask
Land
Pattern
PCBA
Metal Stencil
for Solder
Paste Printing
Stencil
Aperture
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
bytheunitrelativetothelandpattern.Thereshouldbe
nootherSMDcomponentswithinthisarea.Theminimum
solderresiststripwidthrequiredtoavoidsolderbridging
adjacentpadsis0.2mm.Itisrecommendedthattwofi-
duciallycrossesbeplacedatmidlengthofthepadsfor
unitalignment.
Figure A3. Solder stencil aperture
Stencil thickness,
t (mm)
Aperture size (mm)
Length, l
Width, w
0.27mm
.75 +/- 0.05
0.55 +/- 0.05
0.0mm
2.40 +/- 0.05
0.55 +/- 0.05
Recommended Metal Solder Stencil Aperture
It is recommended that only a 0.11mm (0.004 inch) or
a 0.127mm (0.005 inch) thick stencil be used for solder
pasteprinting.Thisistoensureadequateprintedsolder
paste volume and no shorting. See the table below the
drawing for combinations of metal stencil aperture and
metalstencilthicknessthatshouldbeused.Comparedto
0.127mmstencilthickness0.11mmstencilthicknesshas
longer length in land pattern. It is extended outwardly
from transceiver to capture more solder paste volume.
Seefigure3.
Note:Wet/LiquidPhoto-imaginablesolderresist/maskisrecommended.
Figure A4. Adjacent Land Keepout and solder mask areas
j
l
k
h
Units: mm
Solder mask
Dimension
mm
h
0.2
l
3.0
k
3.0
j
8.6
w
l
t
Aperture As Per
Land Dimensions
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