參數(shù)資料
型號(hào): AT17LV65-10SI
廠商: Atmel
文件頁(yè)數(shù): 7/26頁(yè)
文件大?。?/td> 0K
描述: IC SRL CONFIG EEPROM 64K 20SOIC
標(biāo)準(zhǔn)包裝: 38
可編程類(lèi)型: 串行 EEPROM
存儲(chǔ)容量: 64kb
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 管件
產(chǎn)品目錄頁(yè)面: 609 (CN2011-ZH PDF)
配用: ATDH2225-ND - CABLE ISP FOR AT17
ATDH2200E-ND - CONFIGURATOR PROGRAM BOARD KIT
其它名稱(chēng): AT17LV6510SI
15
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
Notes:
1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
21. Thermal Resistance Coefficients(1)
Package Type
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002
AT17LV040
8CN
4
Leadless Array Package (LAP)
θ
JC [° C/W]
45
θ
JA
[
° C/W](2)
115.71
135.71
159.60
8P3
Plastic Dual Inline Package
(PDIP)
θ
JC [° C/W]
37
θ
JA
[
° C/W](2)
107
8S1
Plastic Gull Wing Small Outline
(SOIC)
θ
JC [° C/W]
45
–––
θ
JA
[
° C/W](2)
150
–––
20J
Plastic Leaded Chip Carrier
(PLCC)
θ
JC [° C/W]
35
θ
JA
[
° C/W](2)
90
20S2
Plastic Gull Wing Small Outline
(SOIC)
θ
JC [° C/W]
θ
JA
[
° C/W](2)
44A
Thin Plastic Quad Flat
Package (TQFP)
θ
JC [° C/W]
17
θ
JA
[
° C/W](2)
62
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