參數(shù)資料
型號: AUIRLS4030-7TRR
元件分類: JFETs
英文描述: 190 A, 100 V, 0.0039 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: ROHS COMPLIANT, D2PAK-7
文件頁數(shù): 1/11頁
文件大?。?/td> 339K
代理商: AUIRLS4030-7TRR
08/15/11
www.irf.com
1
HEXFET Power MOSFET
S
D
G
AUIRLS4030-7P
GD
S
Gate
Drain
Source
D2Pak 7 Pin
AUIRLS4030-7P
G
VDSS
100V
RDS(on) typ.
3.2mΩ
max.
3.9mΩ
ID
190A
S
D
S
Specifically designed for Automotive applications, this
HEXFET Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a 175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating . These features
combine to make this design an extremely efficient and
reliable device for use in Automotive applications and a
wide variety of other applications.
Description
Features
l
Optimized for Logic Level Drive
l
Advanced Process Technology
l
Ultra Low On-Resistance
l
175°C Operating Temperature
l
Fast Switching
l
Repetitive Avalanche Allowed up to Tjmax
l
Lead-Free, RoHS Compliant
l
Automotive Qualified *
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications
is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA)
is 25°C, unless otherwise specified.
AUTOMOTIVE GRADE
Parameter
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
A
IDM
Pulsed Drain Current
c
PD @TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
VGS
Gate-to-Source Voltage
V
EAS
Single Pulse Avalanche Energy (Thermally limited) d
mJ
IAR
Avalanche Current c
A
EAR
Repetitive Avalanche Energy f
mJ
dv/dt
Peak Diode Recovery
e
V/ns
TJ
Operating Junction and
°C
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
jk
–––
0.40
°C/W
RθJA
Junction-to-Ambient (PCB Mount)
ij
–––
40
300
Max.
190
130
750
320
See Fig. 14, 15, 22a, 22b
370
13
-55 to + 175
± 16
2.5
10lbf
xin (1.1Nxm)
HEXFET is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
PD - 96399
相關PDF資料
PDF描述
AUIRLS4030-7TRL 190 A, 100 V, 0.0039 ohm, N-CHANNEL, Si, POWER, MOSFET
AUIRLS4030 180 A, 100 V, 0.0043 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
AUIRLS4030TRL 180 A, 100 V, 0.0043 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
AUIRLSL4030 180 A, 100 V, 0.0043 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-262AA
AUIRLS4030TRR 180 A, 100 V, 0.0043 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
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