參數(shù)資料
型號: AUIRLS4030-7TRR
元件分類: JFETs
英文描述: 190 A, 100 V, 0.0039 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: ROHS COMPLIANT, D2PAK-7
文件頁數(shù): 4/11頁
文件大小: 339K
代理商: AUIRLS4030-7TRR
AUIRLS4030-7P
2
www.irf.com
Notes:
Repetitive rating; pulse width limited by max. junction
temperature.
Limited by TJmax, starting TJ = 25°C, L = 0.05mH
RG = 25
Ω, IAS = 110A, VGS =10V. Part not recommended for use
above this value .
ISD ≤ 110A, di/dt ≤ 1520A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
Pulse width ≤ 400μs; duty cycle ≤ 2%.
S
D
G
Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS.
Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering techniques refer to application note #AN-994.
Rθ is measured at TJ approximately 90°C.
RθJC value shown is at time zero.
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
V(BR)DSS
Drain-to-Source Breakdown Voltage
100
–––
V
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient
–––
0.10
–––
V/°C
RDS(on)
Static Drain-to-Source On-Resistance
–––
3.2
3.9
–––
3.3
4.1
VGS(th)
Gate Threshold Voltage
1.0
–––
2.5
V
gfs
Forward Transconductance
250
–––
S
IDSS
Drain-to-Source Leakage Current
–––
20
μA
–––
250
IGSS
Gate-to-Source Forward Leakage
–––
100
nA
Gate-to-Source Reverse Leakage
–––
-100
RG(int)
Internal Gate Resistance
–––
2.0
–––
Ω
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Qg
Total Gate Charge
–––
93
140
nC
Qgs
Gate-to-Source Charge
–––
27
–––
Qgd
Gate-to-Drain ("Miller") Charge
–––
43
–––
Qsync
Total Gate Charge Sync. (Qg - Qgd)
–––
50
–––
td(on)
Turn-On Delay Time
–––
53
–––
ns
tr
Rise Time
–––
160
–––
td(off)
Turn-Off Delay Time
–––
110
–––
tf
Fall Time
–––
87
–––
Ciss
Input Capacitance
––– 11490 –––
Coss
Output Capacitance
–––
680
–––
Crss
Reverse Transfer Capacitance
–––
300
–––
pF
Coss eff. (ER) Effective Output Capacitance (Energy Related)
–––
760
–––
Coss eff. (TR) Effective Output Capacitance (Time Related)
–––
1170
–––
Diode Characteristics
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
–––
190
A
(Body Diode)
ISM
Pulsed Source Current
–––
750
(Body Diode)
VSD
Diode Forward Voltage
–––
1.3
V
trr
Reverse Recovery Time
–––
53
–––
ns
TJ = 25°C
VR = 85V,
–––
63
–––
TJ = 125°C
IF = 110A
Qrr
Reverse Recovery Charge
–––
99
–––
nC TJ = 25°C
di/dt = 100A/μs
f
–––
155
–––
TJ = 125°C
IRRM
Reverse Recovery Current
–––
3.3
–––
A
TJ = 25°C
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
ID = 110A
RG = 2.7Ω
Conditions
VGS = 4.5V f
VGS = 0V
VDS = 50V
= 1.0MHz
VGS = 0V, VDS = 0V to 80V h
VGS = 0V, VDS = 0V to 80V g
TJ = 25°C, IS = 110A, VGS = 0V f
integral reverse
p-n junction diode.
MOSFET symbol
showing the
Conditions
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 5mA
VGS = 10V, ID = 110A f
VDS = VGS, ID = 250μA
VDS = 100V, VGS = 0V
VDS = 100V, VGS = 0V, TJ = 125°C
VGS = 4.5V, ID = 94A f
VDD = 65V
ID = 110A, VDS =0V, VGS = 4.5V
Conditions
VDS = 25V, ID = 110A
ID = 110A
VDS = 50V
VGS = 16V
VGS = -16V
VGS = 4.5V f
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