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參數(shù)資料
| 型號： | BC214C |
| 英文描述： | FPGA Logic IC; Logic Type:Programmable; No. of Macrocells:136; Package/Case:484-FBGA |
| 中文描述： | 晶體管|晶體管|進(jìn)步黨| 30V的五（巴西）總裁| 100mA的一（c）|至92 |
| 文件頁數(shù)： | 3/4頁 |
| 文件大小： | 68K |
| 代理商： | BC214C |
BC212, BC212A, BC212B
BC213, BC213A, BC213B,
BC213C
BC214, BC214B, BC214C
TO-92
Plastic Package
TO-92 Transistors on Tape and Ammo Pack
TO-92 Plastic Package
F
F
H
C
3 2 1
All dimnsions in mm
DIM
MIN.
MAX.
A
B
C
D
E
F
G
H
K
L
4.32
4.45
3.18
0.41
0.35
5.33
5.20
4.19
0.55
0.50
5 DEG
1.14
1.14
12.70
1.982
1.40
1.53
—
2.082
PIN CONFIGURATION
1. COLLECTOR
2. BASE
3. EMITTER
B
A
L
S
D
U
B
K
E
D
A A
SEC AA
G
D
3
21
1
2
3
CUMULATIVE PITCH
ERROR 1.0 mm/20
PITCH
TO BE MEASURED AT
BOTTOM OF CLINCH
AT TOP OF BODY
t1 0.3 - 0.6
BODY WIDTH
BODY HEIGHT
BODY THICKNESS
PITCH OF COMPONENT
FEED HOLE PITCH
FEED HOLE CENTRE TO
COMPONENT CENTRE
DISTANCE BETWEEN OUTER
LEADS
COMPONENT ALIGNMENT
TAPE WIDTH
HOLD-DOWN TAPE WIDTH
HOLE POSITION
HOLD-DOWN TAPE POSITION
LEAD WIRE CLINCH HEIGHT
COMPONENT HEIGHT
LENGTH OF SNIPPED LEADS
FEED HOLE DIAMETER
TOTAL TAPE THICKNESS
LEAD - TO - LEAD DISTANCEF1,
CLINCH HEIGHT
PULL - OUT FORCE
ITEM
A1
A
T
P
Po
P2
F
h
W
Wo
W1
W2
Ho
H1
L
Do
t
F2
H2
(P)
SYMBOL
SPECIFICATION
MIN.
NOM.
4.0
4.8
3.9
6N
12.7
12.7
6.35
5.08
0
18
6
9
0.5
16
4
2.54
4.8
5.2
4.2
1
23.25
11.0
1.2
3
MAX.
±1
±0.3
±0.4
+0.6
-0.2
±0.5
±0.2
+0.7
-0.5
±0.2
±0.5
±0.2
+0.4
-0.1
TOL .
REMARKS
NOTES
1. MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2 mm.
2. MAXIMUM NON-CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1 mm IN 20
PITCHES.
3. HOLDDOWN TAPE NOT TO EXCEED BEYOND THE EDGE(S) OF CARRIER TAPE AND THERE SHALL BE NO
EXPOSURE OF ADHESIVE.
4. NO MORE THAN 3 CONSECUTIVE MISSING COMPONENTS ARE PERMITTED.
5. A TAPE TRAILER, HAVING AT LEAST THREE FEED HOLES ARE REQUIRED AFTER THE LAST COMPONENT.
6. SPLICES SHALL NOT INTERFERE WITH THE SPROCKET FEED HOLES.
All dimensions in mm unless specified otherwise
Ammo Pack Style
Adhesive Tape on Top Side
FLAT SIDE
MECHANICAL DATA
T
t1
t
F1
F2
F
P2
Po
Do
(p)
W2
Wo
W1
W
H1
A
A1
P
H0
L
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Ammo Pack
LABEL
Carrier
Strip
183
mm
FEED
m42
h
h
TO-92 Bulk
TO-92 T&A
1K/polybag
2K/ammo box
200 gm/1K pcs
645 gm/2K pcs
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5K
2K
17" x 15" x 13.5"
17" x 15" x 13.5"
80K
32K
23 kgs
12.5 kgs
PACKAGE
Net Weight/Qty
Details
STANDARD PACK
INNER CARTON BOX
Qty
OUTER CARTON BOX
Qty
Gr Wt
Size
Size
Packing Detail
Continental Device India Limited
Data Sheet
Page 3 of 4
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BC214 | COMPLEMENTARY SILICON AF SMALL SIGNAL AMPLIFIERS & SWITCHES |
| BC214L | COMPLEMENTARY SILICON AF SMALL SIGNAL AMPLIFIERS & SWITCHES |
| BC2I4 | COMPLEMENTARY SILICON AF SMALL SIGNAL AMPLIFIERS & DRIVERS |
| BC2I4L | COMPLEMENTARY SILICON AF SMALL SIGNAL AMPLIFIERS & DRIVERS |
| BCI84 | COMPLEMENTARY SILICON AF SMALL SIGNAL AMPLIFIERS & DRIVERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BC214K | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | BJT | PNP | 30V V(BR)CEO | 200MA I(C) | TO-92 |
| BC214KA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | BJT | PNP | 30V V(BR)CEO | 200MA I(C) | TO-92 |
| BC214KB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | BJT | PNP | 30V V(BR)CEO | 200MA I(C) | TO-92 |
| BC214KC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | BJT | PNP | 30V V(BR)CEO | 200MA I(C) | TO-92 |
| BC214L | 功能描述:兩極晶體管 - BJT PNP -30V -500mA HFE/400 RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
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