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參數(shù)資料
| 型號(hào)： | BMR4532101/000 |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT, QUARTER-BRICK PACKAGE-16 |
| 文件頁數(shù)： | 12/22頁 |
| 文件大小： | 2708K |
| 代理商： | BMR4532101/000 |
Ericsson Internal
PRODUCT SPECIFICATION
2 (4)
Prepared (also subject responsible if other)
No.
EAB/FC/P Jakub Brindell
1/1301- BMR 453 Uen
Approved
Checked
Date
Rev
Reference
EAB/FC/P Jakub Brindell
EJAKBRI
2009-01-23
D
General Information
Ordering Information
Number
Description
BMR453
n1
n2
n3 n4
n5 n6 n7
Default
0 = Standard pin length 5.33 mm
2 = Lead length 3.69 mm (cut)
3 = Lead length 4.57 mm (cut)
4 = Lead length 2.79 mm (cut)
5 = Lead length 2.79 mm stand off 6.7mm
0 = Open frame
1 = Baseplate
2 = Baseplate with GND-pin
00 = With digital interface
01 = Without digital interface
001 = 12V Default configuration variant
002 = 9V Default configuration variant
As an example an open frame, 3.69 mm pin length with digital interface with
configuration variant 002 would be BMR4532000/002.
Reliability
The Mean Time Between Failure (MTBF) is calculated at
full output power and an operating ambient temperature
(TA) of +40°C, which is a typical condition in Information
and Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
-
1.1 million hours according to Telcordia SR332, issue
1, Black box technique.
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
-
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
-
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins made
of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use
to boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
AB’s General Terms and Conditions of Sale. Ericsson AB
does not make any other warranties, expressed or implied
including any warranty of merchantability, effects of product
configurations made by customers or fitness for a particular
purpose.
Ericsson AB 2008
The information and specifications in this technical
specification is believed to be correct at the time of
publication. However, no liability is accepted for
inaccuracies, printing errors or for any consequences
thereof. Ericsson AB reserves the right to change the
contents of this technical specification at any time without
prior notice.
E
BMR 453
DC/DC Converters, Input 36-75V, Output 33A/400 W
EN/LZT 146 395 R1C February 2009
Ericsson AB
Technical Specication
2
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