參數(shù)資料
型號(hào): BU-61703F3-490Z
廠商: DATA DEVICE CORP
元件分類: 微控制器/微處理器
英文描述: 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72
封裝: CERAMIC, QFP-72
文件頁數(shù): 47/54頁
文件大?。?/td> 576K
代理商: BU-61703F3-490Z
51
Data Device Corporation
www.ddc-web.com
BU-61703/61705
D1 web-09/02-0
ORDERING INFORMATION
BU-61705F3-120X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Source
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source and 100% Pull Test
Blank = None of the Above
Test Criteria:
0 = Standard Testing
2 = MIL-STD-1760 Amplitude Compliant (Not available with Voltage/Transceiver Option 4)
Process Requirements:
0 = Standard DDC practices, no Burn-In (See table below.)
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In
Temperature Range**/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
6 = Custom Part (Reserved)
7 = Custom Part (Reserved)
8 = 0°C to +70°C with Variables Test Data
Voltage/Transceiver Option:
3 = +5 Volts rise/fall times = 100 to 300 ns (-1553B)
4 = +5 Volts rise/fall times = 200 to 300 ns (-1553B and McAir
compatible) (Not available with Test Criteria Option “2” MIL-STD-1760 Amplitude Compliant)
Package Type:
F = Flat Pack
G = “Gull Wing” (Formed Lead)
Logic Voltage
3 = 3.3 Volt
5 = 5 Volt
Product Type:
BU-6170 = RT only with simple (non-processor) interface
*Standard DDC Processing with burn-in and full temperature test—see TABLE below.
** Temperature range refers to “Case Temperature”.
1015, TABLE 1
BURN-IN
A
2001
CONSTANT ACCELERATION
C
1010
TEMPERATURE CYCLE
A and C
1014
SEAL
2009, 2010, 2017, and 2032
INSPECTION
CONDITION(S)
METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
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