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參數(shù)資料
| 型號： | CBTL06122AHF |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 編、解碼器及復(fù)用、解復(fù)用 |
| 英文描述： | High-performance DisplayPort-PCIe Gen2 hex display multiplexer |
| 封裝： | CBTL06122AHF<SOT1033-1 (HWQFN56R)|<<http://www.nxp.com/packages/SOT1033-1.html<1<Always Pb-free,;CBTL06122BHF<SOT1033-1 (HWQFN56R)|<<http://www.nxp.com/packages/SOT1033-1 |
| 文件頁數(shù)： | 7/19頁 |
| 文件大小： | 104K |
| 代理商： | CBTL06122AHF |
CBTL06122_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 16 April 2009
15 of 19
NXP Semiconductors
CBTL06122
High-performance DP/PCIe Gen2 hex display multiplexer
13.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 13 and 14
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 9.
Table 13.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 14.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CBTL06122AHF,518 | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 GEN1 HEX DISPLAY RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTL06122AHF,518-CUT TAPE | 制造商:NXP 功能描述:CBTL06122 Series 6 Channel DisplayPort 1:2 PCI Express GEN2 Multiplexer-HWQFN56R |
| CBTL06122AHF518 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| CBTL06122AHF-T | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 GEN1 HEX DISPLAY MULTIPLEXER RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTL06122BHF | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High-performance DisplayPort/PCIe Gen2 hex display multiplexer |
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