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參數(shù)資料
| 型號： | CBTU4411EE |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 開關 |
| 英文描述： | 11-bit DDR2 SDRAM MUX-bus switch with 12 Ohm ON resistance |
| 封裝： | CBTU4411EE<SOT856-1 (LFBGA72)|<<http://www.nxp.com/packages/SOT856-1.html<1<Always Pb-free,;CBTU4411EE<SOT856-1 (LFBGA72)|<<http://www.nxp.com/packages/SOT856-1.html<1 |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 107K |
| 代理商： | CBTU4411EE |
CBTU4411_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 12 October 2009
16 of 20
NXP Semiconductors
CBTU4411
11-bit DDR2 SDRAM MUX/bus switch with 12
ON resistance
15.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 15) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 11 and 12
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 15.
Table 11.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 12.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| CBTU4411EE,518 | 功能描述:數(shù)字總線開關 IC 10BIT DDR SDRAM MUX RoHS:否 制造商:Texas Instruments 開關數(shù)量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| CBTU4411EE,551 | 功能描述:數(shù)字總線開關 IC 10BIT DDR SDRAM MUX RoHS:否 制造商:Texas Instruments 開關數(shù)量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| CBTU4411EE,557 | 功能描述:數(shù)字總線開關 IC 10BIT DDR SDRAM MUX RoHS:否 制造商:Texas Instruments 開關數(shù)量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| CBTU4411EE-S | 功能描述:數(shù)字總線開關 IC 10BIT DDR SDRAM MUX BUS SWITCH RoHS:否 制造商:Texas Instruments 開關數(shù)量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| CBTU4411EE-T | 功能描述:數(shù)字總線開關 IC 10BIT DDR SDRAM MUX BUS SWITCH RoHS:否 制造商:Texas Instruments 開關數(shù)量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
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