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參數(shù)資料
| 型號(hào)： | CS47028C-CQZ |
| 廠商： | CIRRUS LOGIC INC |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 中文描述： | 0-BIT, 24.576 MHz, OTHER DSP, QFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, LQFP-100 |
| 文件頁數(shù)： | 9/17頁 |
| 文件大?。?/td> | 479K |
| 代理商： | CS47028C-CQZ |
CS470xx Data Sheet
Audio SOC Processor Family
DS787PP5
Copyright 2011 Cirrus Logic
17
5.4 Power Supply Characteristics
Note:Measurements performed under operating conditions)
5.5 Thermal Data (100-Pin LQFP with Exposed Pad)
Parameter
Min
Typ
Max
Unit
Operational Power Supply Current:
VDD: Core and I/O operating1
VDDA: PLL operating current
VDDA: DAC operating current (all 8 channels enabled)
VDDA: ADC operating current (all 4 channels enabled)
VDDIO: With most ports operating
Total Operational Power Dissipation:
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLLs halted
VDDA: DAC disabled
VDDA: ADC disabled
VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
1. Dependent on application firmware and DSP clock speed.
-
325
16
56
34
27
1025
410
26
40
24
215
1745
-
mA
mW
A
W
Parameter
Symbol
Min
Typ
Max
Unit
Thermal Resistance (Junction to Ambient)
Two-layer Board1
Four-layer Board2
1. To calculate the die temperature for a given power dissipation:
j = Ambient temperature + [ (Power Dissipation in Watts) * ja ]
2. To calculate the case temperature for a given power dissipation:
c = j - [ (Power Dissipation in Watts) * jt ]
Note:Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers.
Note:Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers and 0.5-oz. copper covering 90% of the internal power plane & ground plane layers.
ja
-
34
18
-
°C / Watt
Thermal Resistance (Junction to Top of Package)
Two-layer Board1
Four-layer Board2
jt
-
0.54
.28
-
°C / Watt
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