參數(shù)資料
型號(hào)： CY7C1161V18-333BZI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： SRAM
英文描述： 18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)
中文描述： 2M X 8 QDR SRAM, 0.45 ns, PBGA165
封裝： 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FPBGA-165
文件頁(yè)數(shù)： 3/29頁(yè)
文件大?。?/td> 659K
代理商： CY7C1161V18-333BZI
CY7C1161V18, CY7C1176V18
CY7C1163V18, CY7C1165V18
Document Number: 001-06582 Rev. *D
Page 11 of 29
Write Cycle Descriptions
The write cycle descriptions of CY7C1161V18 and CY7C1163V18 follow.[3, 11]
BWS0/
NWS0
BWS1/
NWS1
K
Comments
L
L–H
–
During the data portion of a write sequence
:
CY7C1161V18
both nibbles (D
[7:0]) are written into the device.
CY7C1163V18
both bytes (D
[17:0]) are written into the device.
L
–
L-H During the data portion of a write sequence
:
CY7C1161V18
both nibbles (D
[7:0]) are written into the device.
CY7C1163V18
both bytes (D
[17:0]) are written into the device.
L
H
L–H
–
During the data portion of a write sequence
:
CY7C1161V18
only the lower nibble (D
[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1163V18
only the lower byte (D
[8:0]) is written into the device, D[17:9] remains unaltered.
L
H
–
L–H During the data portion of a write sequence
:
CY7C1161V18
only the lower nibble (D
[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1163V18
only the lower byte (D
[8:0]) is written into the device, D[17:9] remains unaltered.
H
L
L–H
–
During the data portion of a write sequence
:
CY7C1161V18
only the upper nibble (D
[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1163V18
only the upper byte (D
[17:9]) is written into the device, D[8:0] remains unaltered.
H
L
–
L–H During the data portion of a write sequence
:
CY7C1161V18
only the upper nibble (D
[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1163V18
only the upper byte (D
[17:9]) is written into the device, D[8:0] remains unaltered.
H
L–H
–
No data is written into the device during this portion of a write operation.
H
–
L–H No data is written into the device during this portion of a write operation.
The write cycle operation of CY7C1176V18 follows.[3, 11]
BWS0
K
Comments
L
L–H
–
During the data portion of a write sequence, the single byte (D[8:0]) is written into the device.
L
–
L–H
During the data portion of a write sequence, the single byte (D[8:0]) is written into the device.
H
L–H
–
No data is written into the device during this portion of a write operation.
H
–
L–H
No data is written into the device during this portion of a write operation.
Note
11. Is based upon a Write cycle was initiated per the Write Cycle Description Truth Table. NWS0, NWS1, BWS0, BWS1, BWS2, and BWS3 can be altered on different
portions of a Write cycle, as long as the setup and hold requirements are achieved.
相關(guān)PDF資料
PDF描述
CY7C1161V18-333BZC 18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1161V18-300BZXI 18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1161V18-300BZXC 18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1161V18 18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1168V18-333BZXC 18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1163KV18-400BZI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18MB (1Mx18) 1.8v 400MHz DDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1163KV18-450BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18MB (1Mx18) 1.8v 450MHz DDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1163KV18-550BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18MB (1Mx18) 1.8v 550MHz DDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C11651KV18-400BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 Sync 靜態(tài)隨機(jī)存取存儲(chǔ)器 QDR RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C11651KV18-400BZXC 功能描述:IC SRAM 18MBIT 400MHZ 165-FPBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF)
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