參數(shù)資料
型號: CY7C1412BV18-167BZI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 36-Mbit QDR-II⑩ SRAM 2-Word Burst Architecture
中文描述: 2M X 18 QDR SRAM, 0.5 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數(shù): 22/26頁
文件大小: 1072K
代理商: CY7C1412BV18-167BZI
PRELIMINARY
CY7C1410BV18
CY7C1425BV18
CY7C1412BV18
CY7C1414BV18
Document #: 001-07036 Rev. *B
Page 22 of 26
Switching Characteristics
Over the Operating Range
[21, 22]
Cypress
Parameter
t
POWER
t
CYC
t
KH
t
KL
t
KHKH
Consortium
Parameter
Description
250 MHz
Min. Max. Min.
1
4.0
6.3
1.6
1.6
1.8
200 MHz
167 MHz
Unit
ms
ns
ns
ns
ns
Max. Min. Max.
1
7.9
6.0
2.4
2.4
2.7
V
DD
(Typical) to the first Access
[23]
K Clock and C Clock Cycle Time
Input Clock (K/K and C/C) HIGH
Input Clock (K/K and C/C) LOW
K Clock Rise to K Clock Rise and C to C Rise (rising
edge to rising edge)
K/K Clock Rise to C/C Clock Rise (rising edge to rising
edge)
1
t
KHKH
t
KHKL
t
KLKH
t
KHKH
5.0
2.0
2.0
2.2
8.4
t
KHCH
t
KHCH
0
1.8
0
2.2
0
2.7
ns
Set-up Times
t
SA
t
SC
t
SCDDR
t
AVKH
t
IVKH
t
IVKH
Address Set-up to K Clock Rise
Control Set-up to K Clock Rise (RPS, WPS)
Double Data Rate Control Set-up to Clock
(K/K) Rise (BWS
0
, BWS
1
, BWS
3
, BWS
4
)
D
[X:0]
Set-up to Clock (K/K) Rise
0.35
0.35
0.35
0.4
0.4
0.4
0.5
0.5
0.5
ns
ns
ns
t
SD[24]
Hold Times
t
HA
t
HC
t
HCDDR
t
DVKH
0.35
0.4
0.5
ns
t
KHAX
t
KHIX
t
KHIX
Address Hold after K Clock Rise
Control Hold after K Clock Rise (RPS, WPS)
Double Data Rate Control Hold after Clock (K/K) Rise
(BWS
0
, BWS
1
, BWS
3
, BWS
4
)
D
[X:0]
Hold after Clock (K/K) Rise
0.35
0.35
0.35
0.4
0.4
0.4
0.5
0.5
0.5
ns
ns
ns
t
HD
Output Times
t
CO
t
KHDX
0.35
0.4
0.5
ns
t
CHQV
C/C Clock Rise (or K/K in Single Clock Mode) to Data
Valid
Data Output Hold after Output C/C Clock Rise (Active
to Active)
C/C Clock Rise to Echo Clock Valid
Echo Clock Hold after C/C Clock Rise
Echo Clock High to Data Valid
Echo Clock High to Data Invalid
Output Clock (CQ/CQ) HIGH
[25]
CQ Clock Rise to CQ Clock Rise
[25]
(rising edge to rising edge)
Clock (C/C) Rise to High-Z (Active to High-Z)
[26,27]
Clock (C/C) Rise to Low-Z
[26,27]
0.45
0.45
0.50
ns
t
DOH
t
CHQX
–0.45
-0.45
-0.50
ns
t
CCQO
t
CQOH
t
CQD
t
CQDOH
t
CQH
t
CQHCQH
t
CHCQV
t
CHCQX
t
CQHQV
t
CQHQX
t
CQHCQL
t
CQHCQH
0.45
0.30
0.45
0.35
0.50
0.40
ns
ns
ns
ns
ns
ns
–0.45
–0.30
1.55
1.55
–0.45
–0.35
1.95
1.95
–0.50
–0.40
2.45
2.45
t
CHZ
t
CLZ
DLL Timing
t
KC Var
t
KC lock
t
KC Reset
Notes:
22.All devices can operate at clock frequencies as low as 119 MHz. When a part with a maximum frequency above 133 MHz is operating at a lower clock frequency,
it requires the input timings of the frequency range in which it is being operated and will output data with the output timings of that frequency range.
23.This part has a voltage regulator internally; t
POWER
is the time that the power needs to be supplied above V
DD
minimum initially before a read or write operation
can be initiated.
24.For D2 data signal on CY7C1425BV18 device, t
is 0.5ns for 200MHz, and 250MHz frequencies.
25.These parameters are extrapolated from the input timing parameters (t
- 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (t
KC Var
) ia already
included in the t
). These parameters are only guaranteed by design and are not tested in production.
26.t
, t
, are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured
±
100 mV from steady-state voltage.
27.At any given voltage and temperature t
CHZ
is less than t
CLZ
and t
CHZ
less than t
CO
.
t
CHQZ
t
CHQX1
0.45
0.45
0.50
ns
ns
–0.45
–0.45
–0.50
t
KC Var
t
KC lock
t
KC Reset
Clock Phase Jitter
DLL Lock Time (K, C)
K Static to DLL Reset
0.20
0.20
0.20
ns
1024
30
1024
30
1024
30
cycles
ns
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