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| 型號： | CY8C24794-SPPX |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | PSoCTM Mixed-Signal Array |
| 中文描述： | PSoCTM混合信號陣列 |
| 文件頁數(shù)： | 7/32頁 |
| 文件大小： | 366K |
| 代理商： | CY8C24794-SPPX |
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April 14, 2005
Document No. 38-12018 Rev. *F
7
CY8C24794 Final Data Sheet
PSoC Overview
Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this doc-
ument.
Units of Measure
A units of measure table is located in the Electrical Specifica-
tions section.
Table 3-1 on page 12
lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in upper-
case with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’ or ‘b’ are decimal.
Table of Contents
For an in depth discussion and more information on your PSoC
device, obtain the
PSoC Mixed-Signal Array Technical Refer-
ence Manual
. This document encompasses and is organized
into the following chapters and sections.
1.
Pin Information ............................................................. 8
1.1
56-Pin Part Pinout .................................................. 8
2.
Register Reference ....................................................... 9
2.1
Register Conventions ............................................. 9
2.1.1
Abbreviations Used .................................... 9
2.2
Register Mapping Tables ....................................... 9
3.
Electrical Specifications ............................................ 12
3.1
Absolute Maximum Ratings ................................. 13
3.2
Operating Temperature ........................................ 13
3.3
DC Electrical Characteristics ................................ 13
3.3.1
DC Chip-Level Specifications ................... 13
3.3.2
DC General Purpose IO Specifications .... 14
3.3.3
DC Full-Speed USB Specifications .......... 14
3.3.4
DC Operational Amplifier Specifications ... 15
3.3.5
DC Analog Output Buffer Specifications ... 17
3.3.6
DC Analog Reference Specifications ....... 18
3.3.7
DC Analog PSoC Block Specifications ..... 19
3.3.8
DC POR and LVD Specifications ............. 19
3.3.9
DC Programming Specifications ............... 20
3.4
AC Electrical Characteristics ................................ 21
3.4.1
AC Chip-Level Specifications ................... 21
3.4.2
AC General Purpose IO Specifications .... 22
3.4.3
AC Full-Speed USB Specifications ........... 22
3.4.4
AC Operational Amplifier Specifications ... 23
3.4.5
AC Digital Block Specifications ................. 25
3.4.6
AC External Clock Specifications ............. 25
3.4.7
AC Analog Output Buffer Specifications ... 26
3.4.8
AC Programming Specifications ............... 27
3.4.9
AC I2C Specifications ............................... 28
4.
Packaging Information ............................................... 29
4.1
Packaging Dimensions ......................................... 29
4.2
Thermal Impedance ............................................. 30
4.3
Solder Reflow Peak Temperature ........................ 30
5.
Ordering Information .................................................. 31
5.1
Ordering Code Definitions .................................... 31
6.
Sales and Company Information ............................... 32
6.1
Revision History ................................................... 32
6.2
Copyrights and Code Protection .......................... 32
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
ECO
external crystal oscillator
EEPROM
electrically erasable programmable read-only memory
FSR
full scale range
GPIO
general purpose IO
GUI
graphical user interface
HBM
human body model
ICE
in-circuit emulator
ILO
internal low speed oscillator
IMO
internal main oscillator
IO
input/output
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
PLL
phase-locked loop
POR
power on reset
PPOR
precision power on reset
PSoC
Programmable System-on-Chip
PWM
pulse width modulator
SC
switched capacitor
SRAM
static random access memory
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY8C24794-SPC | PSoCTM Mixed-Signal Array |
| CY8C24794-SPSX | PSoCTM Mixed-Signal Array |
| CY8C27543-24AXI | PSoC Mixed Signal Array |
| CY8C27643-24LFI | PSoC Mixed Signal Array |
| CY8C27643-24LFIT | PSoC Mixed Signal Array |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY8C24794-SPSX | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:PSoCTM Mixed-Signal Array |
| CY8C24894 | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:PSoC㈢ Mixed-Signal Array |
| CY8C24894_11 | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Automotive PSoC Programmable System-on-Chip Low power at high speed |
| CY8C24894-24LFXA | 功能描述:靜態(tài)隨機存取存儲器 49 I/O 16K FLASH 1K 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY8C24894-24LFXAT | 功能描述:靜態(tài)隨機存取存儲器 49 I/O 16K FLASH 1K 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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