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參數(shù)資料
| 型號(hào)： | DAC7621EG4 |
| 廠商： | Texas Instruments |
| 文件頁(yè)數(shù)： | 4/14頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC 12-BIT D/A PARALLEL 20-SSOP |
| 產(chǎn)品培訓(xùn)模塊： | Data Converter Basics |
| 標(biāo)準(zhǔn)包裝： | 70 |
| 設(shè)置時(shí)間： | 7µs |
| 位數(shù)： | 12 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 5mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 20-SSOP（0.209"，5.30mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-SSOP |
| 包裝： | 管件 |
| 輸出數(shù)目和類(lèi)型： | 1 電壓，單極 |
| 采樣率（每秒）： | 143k |
| 其它名稱(chēng)： | DAC7621E DAC7621E-ND |
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
DAC7621E
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
DAC7621E/1K
ACTIVE
SSOP
DB
20
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
DAC7621E/1KG4
ACTIVE
SSOP
DB
20
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
DAC7621EB
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
B
DAC7621EB/1K
ACTIVE
SSOP
DB
20
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
B
DAC7621EB/1KG4
ACTIVE
SSOP
DB
20
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
B
DAC7621EBG4
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
B
DAC7621EG4
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7621E
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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