11. AGND 13. DB4 12. I
參數(shù)資料
型號(hào): DAC8222FSZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 10/15頁
文件大?。?/td> 0K
描述: IC DAC 12BIT DUAL CMOS 24SOIC
標(biāo)準(zhǔn)包裝: 1,000
設(shè)置時(shí)間: 1µs
位數(shù): 12
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC W
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 2 電流,單極;2 電流,雙極
采樣率(每秒): 1M
DAC8222
–4–
REV. C
11. AGND
13. DB4
12. IOUT A
14. DB3
13. RFB A
15. DB2
14. VREF A
16. DB1
15. DGND
17. DB0 (LSB)
16. DB11(MSB)
18.
DAC A/DAC B
17. DB10
19.
LDAC
18. DB9
20.
WR
19. DB8
21. VDD
10. DB7
22. VREF B
11. DB6
23. RFB B
12. DB5
24. IOUT B
Substrate (die backside) is internally connected to VDD.
DICE CHARACTERISTICS
DIE SIZE 0.124
× 0.132 inch, 16,368 sq. mils
(3.15
× 3.55 mm, 10.56 sq. mm)
WAFER TEST LIMITS (@ V
DD = +5 V or +15 V, VREF A = VREF B = +10 V, VOUT A = VOUT B = 0 V; AGND = DGND = 0 V; TA = +25 C)
DAC8222G
Parameter
Symbol
Conditions
Limit
Units
Relative Accuracy
INL
Endpoint Linearity Error
±1LSB max
Differential Nonlinearity
DNL
All Grades are Guaranteed Monotonic
±1LSB max
Full Scale Gain Error
1
GFSE
Digital Inputs = 1111 1111 1111
±4LSB max
Output Leakage
Digital Inputs = 0000 0000 0000
±50
nA max
(IOUT A, IOUT B)ILKG
Pads 2 and 24
Input Resistance
(VREF A, VREF B)RREF
Pads 4 and 22
8/15
k
max
Input Resistance Match
RREF
±1% max
RREF
Digital Input High
VINH
VDD = +5 V
2.4
V min
VDD = +15 V
13.5
V min
Digital Input Low
VINL
VDD = +5 V
0.8
V max
VDD = +15 V
1.5
V min
Digital Input Current
IIN
VIN = 0 V or VDD; VINL or VINH
±1
A max
Supply Current
IDD
All Digital Inputs VINL or VINH
2
All Digital Inputs 0 V or VDD
0.1
mA max
DC Supply Rejection
PSR
VDD = ±5%
0.002
%/% max
(
Gain/V
DD)
NOTES
1Measured using internal R
FB A and RFB B.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
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